Kon, Masahiro
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1

Study on evaluation of durability of through-hole solder jo..:

, In: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
 
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15

Phylogeny and Biogeography of Wood-Feeding Cockroaches, Gen..:

Maekawa, Kiyoto ; Kon, Masahiro ; Araya, Kunio.
Journal of Molecular Evolution.  53 (2001)  6 - p. 651-659 , 2001
 
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