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Kong, Yanmei
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1

The study of heat characteristics for micro pin-fin heat si..:

Kuang, Nailiang ; Lu, Guoran ; Li, Kui...
Thermal Science.  28 (2024)  2 Part A - p. 889-901 , 2024
Link: https://doi.org/10.2298/..
 
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2

Near-Junction Thermal Management of GaN-on-SiC MMIC Power A..:

Lu, Dichen ; Ye, Yuxin ; Liu, Ruiwen...
IEEE Transactions on Electron Devices.  71 (2024)  1 - p. 502-509 , 2024
Link: https://doi.org/10.1109/..
 
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3

An adaptive thermal management method via bionic sweat pore..:

Yu, Lihang ; Jiao, Binbin ; Ye, Yuxin...
Applied Thermal Engineering.  247 (2024)  - p. 122953 , 2024
Link: https://doi.org/10.1016/..
 
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4

Investigation on the unconstrained microfluidic heat sink w..:

Yu, Lihang ; Ye, Yuxin ; Wang, Zhenyu...
Thermal Science.  28 (2024)  2 Part A - p. 877-888 , 2024
Link: https://doi.org/10.2298/..
 
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5

A Highly Sensitive Dual-Mode Thermal Flow Sensor Based on C..:

Qiao, Jingping ; Chen, Jingyu ; Jiao, Binbin...
IEEE Sensors Journal.  24 (2024)  2 - p. 1245-1254 , 2024
Link: https://doi.org/10.1109/..
 
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6

Low Stress TSV Arrays for High-Density Interconnection:

Jiao, Binbin ; Qiao, Jingping ; Jia, Shiqi...
Engineering.  , 2024
Link: https://doi.org/10.1016/..
 
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7

Experimental Investigations on Thermal Superposition Effect..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Ye, Yuxin ; Du, Xiangbin ; Kong, Yanmei... - p. 1017-1021 , 2023
Link: https://doi.org/10.1109/..
 
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8

Experimental investigations of manifold structure on coolin..:

, In: 2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS),
Li, Wei ; Ye, Yuxin ; Yan, Yingzhan... - p. 120-123 , 2023
Link: https://doi.org/10.1109/..
 
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9

A combined solution of thermoelectric coolers and microchan..:

Cong, Bo ; Kong, Yanmei ; Ye, Yuxin...
Applied Thermal Engineering.  219 (2023)  - p. 119370 , 2023
Link: https://doi.org/10.1016/..
 
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10

Low-stress TSVs for high-density 3D integration:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Qiao, Jingping ; Jiao, Binbin ; Jia, Shiqi... - p. 606-611 , 2023
Link: https://doi.org/10.1109/..
 
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11

Embedded manifold cooling for efficient thermal management ..:

, In: 2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS),
Du, Xiangbin ; Ye, Yuxin ; Kong, Yanmei... - p. 209-212 , 2023
Link: https://doi.org/10.1109/..
 
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12

Investigation on the heat dissipation of high heat flux chi..:

Cong, Bo ; Liu, Ruiwen ; Ye, Yuxin...
Thermal Science.  27 (2023)  1 Part B - p. 869-880 , 2023
Link: https://doi.org/10.2298/..
 
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13

Active Thermal Management of GaN-on-SiC HEMT With Embedded ..:

Ye, Yuxin ; Wu, Mei ; Kong, Yanmei...
IEEE Transactions on Electron Devices.  69 (2022)  10 - p. 5470-5475 , 2022
Link: https://doi.org/10.1109/..
 
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14

Embedded manifold cooling system for high performance compu..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Ye, Yuxin ; Wang, Jie ; Yu, Lihang... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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15

Experimental investigation of the embedded micro-channel ma..:

Zhang, Nan ; Liu, Ruiwen ; Kong, Yanmei...
Thermal Science.  26 (2022)  2 Part B - p. 1531-1543 , 2022
Link: https://doi.org/10.2298/..
 
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