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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
1
Chip-to-Chip Hybrid Bonding with Larger-Oriented Cu Grains ..:
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2023 IEEE International 3D Systems Integration Conference (3DIC) ,
2
Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
3
Cu-SiO2 Hybrid Bonding Yield Enhancement Through Cu Grain E..:
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2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ,
4
Nano Ni/Cu-TSVs with an Improved Reliability for 3D-IC Inte..:
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ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference ,
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