Kulse, M.
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2

Influence of Process Parameters on Surface Activated Alumin..:

Schulze, Sebastian ; Vob, T. ; Kruger, P....
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  3 - p. 578-586 , 2022
 
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Silicon nitride waveguide coupled 67+ GHz Ge photodiode for..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Lischke, S. ; Fraschke, M. ; Richter, H.... - p. 33.2.1-33.2.4 , 2019
 
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Development of a Through-Silicon Via (TSV) Process Module f..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Wietstruck, M. ; Marschmeyer, S. ; Kulse, P.... - p. 2267-2274 , 2018
 
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6

Graphene Synthesis and Processing on Ge Substrates:

Lupina, G. ; Lukosius, M. ; Lippert, G....
ECS Journal of Solid State Science and Technology.  6 (2017)  5 - p. M55-M59 , 2017
 
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8

InP-Si BiCMOS Heterointegration Using a Substrate Transfer ..:

Lisker, M. ; Trusch, A. ; Krüger, A....
ECS Journal of Solid State Science and Technology.  3 (2013)  2 - p. P17-P20 , 2013
 
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10

Ultrathin TiN Membranes as a Technology Platform for CMOS-I..:

Birkholz, M. ; Ehwald, K.-E. ; Kulse, P....
Advanced Functional Materials.  21 (2011)  9 - p. 1652-1656 , 2011
 
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