Kung, Ming-Lung
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2

Double N Stubs for Impedance Matching Improvement of Pogo P..:

Kung, Ming-Lung ; Tung, Ya-Ting ; Lin, Ken-Huang...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  7 - p. 1070-1073 , 2023
 
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3

Antenna in Package with Double-Layer Parasitic Elements for..:

, In: 2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI),
Kung, Ming-Lung ; Lin, Yi-Hsuan ; Lin, Ken-Huang... - p. 381-382 , 2023
 
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4

Signal Integrity Improvement on High-Speed Packaging Routin..:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
 
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5

Near-Field Wireless Power Transfer System with Efficiency T..:

, In: 2019 IEEE 8th Global Conference on Consumer Electronics (GCCE),
Kung, Ming-Lung ; Chen, Feng-Yu ; Lin, Ken-Huang - p. 610-611 , 2019
 
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7

An Integrated CMOS Low Noise Amplifier for 3-5 GHz UWB Appl..:

, In: 2005 IEEE Conference on Electron Devices and Solid-State Circuits,
Shih-Chih Chen ; Ruey-Lue Wang ; Ming-Lung Kung. - p. 225-228 , 2005
 
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8

An integrated CMOS low noise amplifier for ultra wide band ..:

, In: 2005 International Conference on Wireless Networks, Communications and Mobile Computing,
Shih-Chih Chen ; Ruey-Lue Wang ; Ming-Lung Kung. - p. 1354,1355,1356,1357 , 2005
 
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10

Effect of Electric Potential and Mechanical Force on Copper..:

Chen, Sheng-Wen ; Kung, Te-Ming ; Liu, Chuan-Pu...
Japanese Journal of Applied Physics.  51 (2012)  3R - p. 036504 , 2012
 
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11

Effect of Electric Potential and Mechanical Force on Copper..:

Chen, Sheng-Wen ; Kung, Te-Ming ; Liu, Chuan-Pu...
Japanese Journal of Applied Physics.  51 (2012)  3R - p. 036504 , 2012
 
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