Kuo, Chenghsuan
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1

Co Metal ALD on Cu with Cyclic Clean by Peroxide and Hydraz..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Kuo, Cheng-Hsuan ; Pal, Dipayan ; Wang, Victor... - p. 1-2 , 2024
 
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2

Inverse Hybrid Bonding with Metal Oxide Framework as Infill..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Sahay, Rohan ; Pal, Dipayan ; Victor, Ashita... - p. 1837-1840 , 2024
 
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4

Low-Resistivity Titanium Nitride Thin Films Fabricated by A..:

Kuo, Cheng-Hsuan ; Mcleod, Aaron J. ; Lee, Ping-Che...
ACS Applied Electronic Materials.  5 (2023)  8 - p. 4094-4102 , 2023
 
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5

Towards Selective Cobalt Atomic Layer Deposition for Chip-t..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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6

Reverse Templating Effects of Low-Resistivity Ru ALD on Spu..:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),
 
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8

Low Resistivity Titanium Nitride Thin Film Fabricated by At..:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),
Kuo, Cheng-Hsuan ; Mcleod, Aaron J ; Huang, James... - p. 76-78 , 2022
 
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9

Sub-Nanometer Interfacial Oxides on Highly Oriented Pyrolyt..:

Zhang, Zichen ; Passlack, Matthias ; Pitner, Gregory...
ACS Applied Materials & Interfaces.  14 (2022)  9 - p. 11873-11882 , 2022
 
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12

Classification of Dementia Based on Over-Sampling Approach ..:

, In: Proceedings of the 2018 International Conference on Big Data and Education,
 
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