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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
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Co Metal ALD on Cu with Cyclic Clean by Peroxide and Hydraz..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Inverse Hybrid Bonding with Metal Oxide Framework as Infill..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Towards Selective Cobalt Atomic Layer Deposition for Chip-t..:
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2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) ,
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Reverse Templating Effects of Low-Resistivity Ru ALD on Spu..:
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2022 IEEE International Interconnect Technology Conference (IITC) ,
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Low Resistivity Titanium Nitride Thin Film Fabricated by At..:
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Proceedings of the 2018 International Conference on Big Data and Education ,
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