Kuo, Chun-Liang
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2

Study on Enhancing Flip-Chip-Chip Scale Package (FCCSP) Rel..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
 
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3

Reliability Prediction and Improvement of Board-Level Therm..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chen, Dao-Long ; Chen, Tang-Yuan ; Lai, Wei-Hong... - p. 995-998 , 2023
 
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A Study of JEDEC Board-Level Drop Test Performance Predicti..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
 
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8

Study on burr occurrence and surface integrity during slot ..:

Li, Maojun ; Huang, Mingjie ; Jiang, Xiaogeng..
The International Journal of Advanced Manufacturing Technology.  97 (2018)  1-4 - p. 163-173 , 2018
 
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10

Study of magnetic ferrite nanoparticles labeled with 99mTc-..:

Wang, Ai-Yih ; Kuo, Chun-Liang ; Lin, Jiunn-Liang..
Journal of Radioanalytical and Nuclear Chemistry.  284 (2010)  2 - p. 405-413 , 2010
 
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