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Kuo, Hung Chun
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1

High Speed D2D Interface Applied on Advanced Package:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Wang, Chen Chao ; Huang, Chih Yi ; Kuo, Hung Chun... - p. 269-270 , 2024
Link: https://doi.org/10.23919..
 
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2

Electrical Performance Analysis for Bridge Die Package Solu..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Pan, Po Chih ; Chu, Fu Cheng ; Kuo, Hung Chun... - p. 113-114 , 2022
Link: https://doi.org/10.23919..
 
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3

High Density IO Fan-out Design Optimization with Signal Int..:

, In: 2019 IEEE CPMT Symposium Japan (ICSJ),
Chang, Keng Tuan ; Huang, Chih Yi ; Kuo, Hung Chun... - p. 217-221 , 2019
Link: https://doi.org/10.1109/..
 
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4

Pervaporative separation of azeotropic methanol/toluene mix..:

Lue, Shingjiang Jessie ; Ou, Jia Shyang ; Kuo, Chun Hung..
Journal of Membrane Science.  347 (2010)  1-2 - p. 108-115 , 2010
Link: https://doi.org/10.1016/..
 
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5

Vapor permeation modeling of multi-component systems using ..:

Lue, Shingjiang Jessie ; Chen, Wen Wei ; Wu, Su Yu..
Journal of Membrane Science.  311 (2008)  1-2 - p. 380-389 , 2008
Link: https://doi.org/10.1016/..
 
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6

Developing Pavement Maintenance Strategies and Implementing..:

Huang, Li-Ling ; Lin, Jyh-Dong ; Huang, Wei-Hsing...
Infrastructures.  9 (2024)  7 - p. 101 , 2024
Link: https://doi.org/10.3390/..
 
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7

Integrated Design Ecosystem for Chiplets Heterogeneous Inte..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Cao, Lihong ; Wang, Chen-Chao ; Huang, Chih-Yi. - p. 1048-1053 , 2024
Link: https://doi.org/10.1109/..
 
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8

A Low-Cost Antenna-in-Package (AiP) for D-Band Application:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kuo, Hung-Chun ; Wu, Po-I ; Jhong, Ming-Fong.. - p. 481-486 , 2023
Link: https://doi.org/10.1109/..
 
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9

Creative Design and Structure Applied to Chiplets Packaging:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Wang, Chen-Chao ; Huang, Chih-Yi ; Kuo, Hung-Chun... - p. 1353-1358 , 2023
Link: https://doi.org/10.1109/..
 
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10

Crosstalk Mitigation for High Speed SerDes Applications on ..:

, In: 2023 IEEE CPMT Symposium Japan (ICSJ),
Hung, Li-Chieh ; Kuo, Hung-Chun ; Jhong, Ming-Fong. - p. 160-163 , 2023
Link: https://doi.org/10.1109/..
 
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11

Share buybacks and corporate tax cuts:

Chang, Juin-Jen ; Kuo, Chun-Hung ; Lin, Hsieh-Yu.
Journal of Economic Dynamics and Control.  151 (2023)  - p. 104622 , 2023
Link: https://doi.org/10.1016/..
 
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12

Mitigate Package Level Crosstalk Using Tabbed Design:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Tsai, Cheng-Yu ; Kuo, Hung-Chun ; Jhong, Ming-Fong. - p. 237-239 , 2023
Link: https://doi.org/10.1109/..
 
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13

Semiconductor Package Design Flow and Platform Applied on F..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Lin, Youle ; Chang, Keng-Tuan ; Kuo, Hung-Chun.. - p. 21-22 , 2023
Link: https://doi.org/10.23919..
 
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14

Labor Share Dynamics and Factor Complementarity:

Chang, Juin-Jen ; Kuo, Chun-Hung
The B.E. Journal of Macroeconomics.  23 (2022)  1 - p. 27-55 , 2022
Link: https://doi.org/10.1515/..
 
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15

Advanced Fanout Packaging Technology for Hybrid Substrate I..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Cao, Lihong ; Lee, Teck Chong ; Chen, Rick... - p. 1362-1370 , 2022
Link: https://doi.org/10.1109/..
 
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