Kuo, Sheng-Liang
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1

Advanced Thermal Integration for HPC Packages with Two-Phas..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lin, Po-Yao ; Kuo, Sheng-Liang ; Yan, Kathy.. - p. 566-573 , 2022
 
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2

Thermal Challenges for HPC 3DIC Packages and Systems:

, In: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Yan, Kathy ; Lin, Po-Yao ; Kuo, Sheng-Liang - p. 151-153 , 2022
 
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3

Thermal Characteristics of Integrated Fan-Out on Substrate ..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Hsu, Chia-Hao ; Lin, Yi-Jou ; Kuo, Sheng-Liang... - p. 212-218 , 2020
 
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4

Leakage-Aware Dynamic Compact Thermal Model for CMOS Techno..:

, In: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Pan, Chi-Wen ; Huang, Pei-Yu ; Hsu, Chia-Hao.. - p. 355-361 , 2019
 
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10

Poly(butylene adipate-co-terephthalate) biodegradation by P..:

Tseng, Wei-Sung ; Lee, Min-Jia ; Wu, Jin-An...
Applied Microbiology and Biotechnology.  107 (2023)  19 - p. 6057-6070 , 2023
 
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12

The relationship between anthropometric factors and hyperur..:

Kuo, Kuan-Liang ; Chen, Hung-Ming ; Hsiao, Sheng-Huang...
Obesity Research & Clinical Practice.  15 (2021)  4 - p. 375-380 , 2021
 
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