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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Advanced Thermal Integration for HPC Packages with Two-Phas..:
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2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ,
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Thermal Challenges for HPC 3DIC Packages and Systems:
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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Thermal Characteristics of Integrated Fan-Out on Substrate ..:
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2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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