Search for persons
X
?
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Low Temperature Cu/SiO2 Hybrid Bonding Using Area-Selective..:
, In:
?
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
3
Low Temperature and Fine Pitch Nanocrystalline Cu/SiCN Wafe..:
, In:
?
2023 IEEE International Solid- State Circuits Conference (ISSCC) ,
13