E-LIB Suche - Ergebnisse für: Kweon, YoungDo

1

Thermal Performance of an Indium-Silver Alloy Metal TIM for..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Kim, SangHyuk ; Sohn, EunSook ; Kweon, YoungDo. - p. 1498-1503 , 2024

2

Phenolic prepregs for automated composites manufacturing – ..:

Szpoganicz, Eduardo ; Demleitner, Martin ; Hübner, Fabian...
Composites Science and Technology. 218 (2022) - p. 109188 , 2022

Link: https://doi.org/10.1016/..

3

Development of an Extremely High Thermal Conductivity TIM f..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),

Choi, MiKyeong ; Jung, HyunHye ; Oh, KwangSeok... - p. 1332-1337 , 2020

Link: https://doi.org/10.1109/..

4

The Formation of Ultra Fine Cu Metal Line with Sub 5 Micron..:

Lee, Youngjae ; Harr, Kyoungmoo ; Lee, Chang-Bae...
ECS Transactions. 52 (2013) 1 - p. 337-341 , 2013

Link: https://doi.org/10.1149/..

5

Board Level Reliability of Solder Joint with a Low CTE PCB:

Harr, Kyoungmoo ; Lee, Chang-Bae ; Kim, Yoon-Su...
ECS Transactions. 44 (2012) 1 - p. 975-983 , 2012

Link: https://doi.org/10.1149/..

6

Advanced Bump Structure for Improving the Board Level Chara..:

Lee, ChangBae ; Choi, Jongwoo ; Kim, Jin-Su...
ECS Transactions. 34 (2011) 1 - p. 879-885 , 2011

Link: https://doi.org/10.1149/..

7

MUF Technology Development for SiP Module:

Kweon, YoungDo ; Ha, Job ; Kim, KiChan...
ECS Transactions. 34 (2011) 1 - p. 865-871 , 2011

Link: https://doi.org/10.1149/..

8

A low-cost through via interconnection for ISM WLP:

Yuan, Jingli ; Jeung, Won-Kyu ; Lim, Chang-Hyun...
Microsystem Technologies. 15 (2009) 8 - p. 1273-1277 , 2009

Link: https://doi.org/10.1007/..

9

Wafer Level SAW RF Filter Packaging With Through Wafer Via ..:

Kweon, Youngdo ; Park, Seungwook ; Kim, Taehoon...
ECS Transactions. 18 (2009) 1 - p. 763-768 , 2009

Link: https://doi.org/10.1149/..

10

Novel Molded FCBGA Package Platform for Highly Reliable Aut..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

InRak.Kim ; Nari.Kim ; Gayoung.Shin.. - p. 949-954 , 2024

Link: https://doi.org/10.1109/..

11

A Low-cost Through Via Interconnection for ISM WLP:

Yuan, Jingli ; Jeung, Won-Kyu ; Lim, Chang-Hyun...
hal-00277690. , 2008

Link: https://hal.archives-ouv..

12

Flavimarina flava sp. nov., isolated from Salicornia herbac..:

Cho, Eui-Sang ; Cha, In-Tae ; Park, Jung-Min...
International Journal of Systematic and Evolutionary Microbiology. 67 (2017) 10 - p. 4240-4245 , 2017

Link: https://doi.org/10.1099/..

13

RON is associated with tumor progression via the inhibition..:

Song, Young‐A. ; Park, Young‐Lan ; Kim, Kyu‐Yeol...
Pathology International. 62 (2011) 2 - p. 127-136 , 2011

Link: https://doi.org/10.1111/..