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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
3
Reliability Challenges of Large Organic Substrate with High..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
4
Reliability Challenges of High-Density Fan-out Packaging fo..:
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Proceedings of the ACM 2012 conference on Computer Supported Cooperative Work ,
11