Lai, Charles
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3

Reliability Challenges of Large Organic Substrate with High..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lin, Rosa ; Yip, Laurene ; Lai, Charles... - p. 277-282 , 2023
 
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4

Reliability Challenges of High-Density Fan-out Packaging fo..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Yip, Laurene ; Lin, Rosa ; Lai, Charles. - p. 1454-1458 , 2022
 
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11

Going to college and staying connected : communication b..:

, In: Proceedings of the ACM 2012 conference on Computer Supported Cooperative Work,
 
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13

A Prospective Review of Hip Fracture Subtypes, Surgical Pro..:

Mak, Jenson C. S. ; Lattouf, Ihab ; Narushevich, Alexei...
Geriatric Orthopaedic Surgery & Rehabilitation.  2 (2011)  2 - p. 45-50 , 2011
 
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