E-LIB Suche - Ergebnisse für: Lai, Wei-Hong

1

Characterization of OH species in kHz air/H2O atmospheric p..:

Huang, Cheng-Liang ; Liao, Tzu-Yi ; He, Yi-Ting...
Plasma Sources Science and Technology. 33 (2024) 6 - p. 065005 , 2024

Link: https://doi.org/10.1088/..

2

Solder Joint Reliability Comparison Under JEDEC Drop and Sy..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Shih, Meng-Kai ; Ke, Zih-Jun ; Yen, Chun-Yu.. - p. 153-154 , 2024

Link: https://doi.org/10.23919..

3

Electrochemical coupling in subnanometer pores/channels for..:

Lei, Yao-Jie ; Zhao, Lingfei ; Lai, Wei-Hong...
Chemical Society Reviews. 53 (2024) 8 - p. 3829-3895 , 2024

Link: https://doi.org/10.1039/..

4

Understanding the charge transfer effects of single atoms f..:

Lei, Yao-Jie ; Lu, Xinxin ; Yoshikawa, Hirofumi...
Nature Communications. 15 (2024) 1 - p. , 2024

Link: https://doi.org/10.1038/..

5

Lithium-Ion Charged Polymer Channels Flattening Lithium Met..:

Duan, Haofan ; You, Yu ; Wang, Gang...
Nano-Micro Letters. 16 (2024) 1 - p. , 2024

Link: https://doi.org/10.1007/..

6

Increased Apolipoprotein A1 Expression Correlates with Tumo..:

Chang, Chih-Chia ; Chang, Chia-Bin ; Chen, Chiung-Ju...
Current Issues in Molecular Biology. 46 (2024) 3 - p. 2155-2165 , 2024

Link: https://doi.org/10.3390/..

7

Investigation of Wafer Warpage Evolution Baesd on Fan-Out C..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Yang, Hung-Chun ; Lai, Wei-Hong ; Kao, Chin-Li.. - p. 151-152 , 2024

Link: https://doi.org/10.23919..

8

High Acceleration Dynamic Methodology for Board-Level Shock..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Yu, Min-Cheng ; Wu, Nan-Yi ; Wang, Wu-Lung... - p. 1213-1218 , 2024

Link: https://doi.org/10.1109/..

9

Reappraisal of hard carbon anodes for practical lithium/sod..:

LeGe, Niubu ; He, Xiang-Xi ; Wang, Yun-Xiao...
Energy & Environmental Science. 16 (2023) 12 - p. 5688-5720 , 2023

Link: https://doi.org/10.1039/..

10

Post-Buckling Analysis for Addressing Asymmetric Warping of..:

, In: 2023 International Conference on Electronics Packaging (ICEP),

Chen, Chia-Yu ; Lee, Yu-Ching ; Chen, Kuo-Shen... - p. 265-266 , 2023

Link: https://doi.org/10.23919..

11

Board-Level Drop Reliability Analysis for Fine-Pitch BGA Pa..:

, In: 2023 IEEE CPMT Symposium Japan (ICSJ),

Lai, Wei-Hong ; Yang, Hung-Chun ; Hsu, Meng-Chi.. - p. 97-100 , 2023

Link: https://doi.org/10.1109/..

12

Regulating the oxidation state of copper centers in metal-o..:

Xie, Wenke ; Liu, Xuan-He ; Wang, Yun-Xiao..
Cell Reports Physical Science. 4 (2023) 10 - p. 101587 , 2023

Link: https://doi.org/10.1016/..

13

Reliability Prediction and Improvement of Board-Level Therm..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),

Chen, Dao-Long ; Chen, Tang-Yuan ; Lai, Wei-Hong... - p. 995-998 , 2023

Link: https://doi.org/10.1109/..

14

Net zero emission goals demand worldwide cooperation:

Dou, Shi Xue ; Lai, Wei-Hong ; Cook, Chris
National Science Review. 10 (2023) 11 - p. , 2023

Link: https://doi.org/10.1093/..

15

Board-Level Drop Impact Reliability Analysis of Dual-Side M..:

Shih, Meng-Kai ; Wu, Nan-Yi ; Lai, Wei-Hong...
IEEE Transactions on Electron Devices. 70 (2023) 1 - p. 215-221 , 2023

Link: https://doi.org/10.1109/..