E-LIB Suche - Ergebnisse für: Lai, Yi-Shao

1

Characterising Arrhenius moisture diffusivity constants usi..:

Wong, E.H. ; Cook, J. ; Dreno, M...
Microelectronics Reliability. 55 (2015) 11 - p. 2331-2335 , 2015

Link: https://doi.org/10.1016/..

2

Thermal resistance of side by side multi-chip package: Ther..:

Chen, Dao-Long ; Chen, Tei-Chen ; Yang, Ping-Feng.
Microelectronics Reliability. 55 (2015) 5 - p. 822-831 , 2015

Link: https://doi.org/10.1016/..

3

Power electronics packaging:

Suganuma, Katsuaki ; Song, Jenn-Ming ; Lai, Yi-Shao
Microelectronics Reliability. 55 (2015) 12 - p. 2523 , 2015

Link: https://doi.org/10.1016/..

4

Nanotribological properties of ALD-processed bilayer TiO2/Z..:

Wang, Wun-Kai ; Wen, Hua-Chiang ; Cheng, Chun-Hu...
Microelectronics Reliability. 54 (2014) 12 - p. 2754-2759 , 2014

Link: https://doi.org/10.1016/..

5

A new representation for anisotropic viscoelastic functions:

Chen, Dao-Long ; Yang, Ping-Feng ; Lai, Yi-Shao..
Mathematics and Mechanics of Solids. 21 (2014) 6 - p. 685-708 , 2014

Link: https://doi.org/10.1177/..

6

Using DMA to Simultaneously Acquire Young's Relaxation Modu..:

Chen, Dao-Long ; Chiu, Tz-Cheng ; Chen, Tei-Chen...
Procedia Engineering. 79 (2014) - p. 153-159 , 2014

Link: https://doi.org/10.1016/..

7

Investigation of electromigration reliability of redistribu..:

Kao, Chin-Li ; Chen, Tei-Chen ; Lai, Yi-Shao.
Microelectronics Reliability. 54 (2014) 11 - p. 2471-2478 , 2014

Link: https://doi.org/10.1016/..

8

Advanced Flip Chip Packaging:

Tong, Ho-Ming ; Lai, Yi-Shao ; Wong, C.P. , 2013

Link: http://suub-bremen.ciand..

9

Rapid, low temperature microwave synthesis of durable, supe..:

Wang, Chih-Feng ; Chen, Hsuan-Yu ; Kuo, Shiao-Wei..
RSC Advances. 3 (2013) 25 - p. 9764 , 2013

Link: https://doi.org/10.1039/..

10

Ball Impact Reliability of Zn-Sn High-Temperature Solder Jo..:

Song, Jenn-Ming ; Lin, Meng-Ju ; Hsieh, Kun-Hung...
Journal of Electronic Materials. 42 (2013) 9 - p. 2813-2821 , 2013

Link: https://doi.org/10.1007/..

11

Reliability of micro-interconnects in 3D IC packages:

Robert Kao, C. ; Wu, Albert T. ; Tu, King-Ning.
Microelectronics Reliability. 53 (2013) 1 - p. 1 , 2013

Link: https://doi.org/10.1016/..

12

The influence of Pd on the interfacial reactions between th..:

Lin, Yu-Wei ; Ke, Wun-Bin ; Wang, Ren-You...
Surface and Coatings Technology. 231 (2013) - p. 599-603 , 2013

Link: https://doi.org/10.1016/..

13

On non-monotonicity of linear viscoelastic functions:

Chen, Dao-Long ; Yang, Ping-Feng ; Lai, Yi-Shao..
Mathematics and Mechanics of Solids. 20 (2013) 5 - p. 600-613 , 2013

Link: https://doi.org/10.1177/..

14

Electrorecrystallization of Metal Alloy:

Chiu, Ying-Ta ; Lin, Kwang-Lung ; Wu, Albert T....
Journal of Alloys and Compounds. 549 (2013) - p. 190-194 , 2013

Link: https://doi.org/10.1016/..

15

Study of factors affecting warpage of HFCBGA subjected to r..:

Wang, Tong Hong ; Tsai, Ching-I ; Lee, Chang-Chi.
Microelectronics Reliability. 53 (2013) 2 - p. 297-302 , 2013

Link: https://doi.org/10.1016/..