Lakkaraju, Anish Rao
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1

Study of Interaction Between Reflow Solder Flux and Humidit..:

Lakkaraju, Anish Rao ; Conseil-Gudla, Helene ; Ambat, Rajan
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  3 - p. 510-518 , 2024
 
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Effect of flux activator in reflow process related flux res..:

Li, Feng ; Lakkaraju, Anish Rao ; Jellesen, Morten Stendahl.
Journal of Materials Science: Materials in Electronics.  34 (2023)  16 - p. , 2023
 
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Study of interaction between Reflow solder flux and humidit..:

Lakkaraju, Anish Rao ; Conseil-Gudla, Helene ; Ambat, Rajan
https://orbit.dtu.dk/en/publications/b82932d6-2893-453e-bf6c-bb45b2e37c16.  , 2024
 
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5

Effect of flux activator in reflow process related flux res..:

Li, Feng ; Lakkaraju, Anish Rao ; Jellesen, Morten Stendahl.
https://orbit.dtu.dk/en/publications/beb81ea6-cda3-4cee-8b06-3b6361a15365.  , 2023
 
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6

Solder mask surface properties and related PCBA failure due..:

Lakkaraju, Anish Rao ; Conseil-Gudla, Helene ; Steiner, Frantisek.
Lakkaraju , A R , Conseil-Gudla , H , Steiner , F & Ambat , R 2021 , ' Solder mask surface properties and related PCBA failure due to build-up of water layer ' , EUROCORR 2021 , Budapest , Hungary , 20/09/2021 - 24/09/2021 ..  , 2021
 
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