E-LIB Suche - Ergebnisse für: Lau, Daniel

1

Design and Fabrication of 2.5D Cryogenic Interposer With In..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Li, HongYu ; Chui, King-Jien ; Kiat Goh, Simon Chun... - p. 458-463 , 2024

2

BimodalPS: Causes and Corrections for Bimodal Multi-Path in..:

Zhang, Yu ; Lau, Daniel L.
IEEE Transactions on Pattern Analysis and Machine Intelligence. 46 (2024) 6 - p. 4001-4017 , 2024

Link: https://doi.org/10.1109/..

3

Electrical Characterization and Reliability Studies of Nano..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Tseng, Ya-Ching ; Chui, King-Jien ; Goh, Simon Chun Kiat... - p. 1581-1586 , 2024

Link: https://doi.org/10.1109/..

4

Adaptive phase measuring profilometry for robustly detectin..:

Zhao, Xiaobing ; Zhang, Geyou ; Lau, Daniel L....
Optics Communications. 552 (2024) - p. 130061 , 2024

Link: https://doi.org/10.1016/..

5

Learning Hypergraphs Tensor Representations From Data via t..:

Pena-Pena, Karelia ; Taipe, Lucas ; Wang, Fuli..
IEEE Transactions on Signal and Information Processing over Networks. 10 (2024) - p. 17-31 , 2024

Link: https://doi.org/10.1109/..

6

Parallel Graph Signal Processing: Sampling and Reconstructi..:

Dapena, Daniela ; Lau, Daniel L. ; Arce, Gonzalo R.
IEEE Transactions on Signal and Information Processing over Networks. 9 (2023) - p. 190-206 , 2023

Link: https://doi.org/10.1109/..

7

Circular fringe projection profilometry and 3D sensitivity ..:

Zhang, Geyou ; Lau, Daniel L. ; Xu, Bin..
Optics and Lasers in Engineering. 162 (2023) - p. 107403 , 2023

Link: https://doi.org/10.1016/..

8

t-HGSP: Hypergraph Signal Processing Using t-Product Tensor..:

Pena-Pena, Karelia ; Lau, Daniel L. ; Arce, Gonzalo R.
IEEE Transactions on Signal and Information Processing over Networks. 9 (2023) - p. 329-345 , 2023

Link: https://doi.org/10.1109/..

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