Lau, Keng Ming
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5

Embedded Liquid Cooling of High-Power Microelectronics Usin..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Feng, Huicheng ; He, Bin ; Tang, Gongyue... - p. 1569-1574 , 2024
 
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6

Two-Phase Liquid Cooling for High-Power Microelectronics vi..:

Feng, Huicheng ; Tang, Gongyue ; Zhang, Xiaowu...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  3 - p. 397-405 , 2024
 
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7

Development of Crossflow Manifold for Two-Phase Liquid Cool..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Feng, Huicheng ; Tang, Gongyue ; Zhang, Xiaowu... - p. 1012-1016 , 2023
 
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8

Embedded Micro-Pin Fin Heat Sink of Two-Phase Liquid Coolin..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Feng, Huicheng ; Tang, Gongyue ; Zhang, Xiaowu... - p. 1964-1968 , 2023
 
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14

On the way: Hailing a taxi with a smartphone? A hybrid SEM-..:

Amos Junke Lau ; Garry Wei-Han Tan ; Xiu-Ming Loh...
http://www.sciencedirect.com/science/article/pii/S2666827021000153.  , 2021
 
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