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2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) ,
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SOI pMOS drain leakage understanding based on TCAD and meas..:
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2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) ,
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Doped Channel SOI pMOS TCAD Description Including Floating ..:
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2022 International Electron Devices Meeting (IEDM) ,
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3-Tier BSI CIS with 3D Sequential & Hybrid Bonding Enabling..:
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2021 IEEE International Electron Devices Meeting (IEDM) ,
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3D sequential integration: applications and associated key ..:
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Shellfish Safety and Quality ,
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Viral contaminants of molluscan shellfish: detection and ch..:
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Improving Seafood Products for the Consumer ,
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