E-LIB Suche - Ergebnisse für: Lee, Chang-Chun

Lee, Chang-Chun ; Wang, Chi-Wei ; Syu, Ji-Yuan.
IEEE Transactions on Components, Packaging and Manufacturing Technology. 14 (2024) 5 - p. 824-831 , 2024

Link: https://doi.org/10.1109/..

8

Development and verification of interfacial fracture energy..:

Lee, Chang-Chun ; Shih, Ruei-Ci ; Lin, Yen-Hung
Engineering Fracture Mechanics. 296 (2024) - p. 109851 , 2024

Link: https://doi.org/10.1016/..

9

Modeling the cure shrinkage–induced warpage of epoxy moldin..:

Lee, Chang-Chun ; Lin, Hao-Zhou
International Journal of Mechanical Sciences. 268 (2024) - p. 109056 , 2024

Link: https://doi.org/10.1016/..

10

Author Correction: Vaccination induces broadly neutralizing..:

Schiffner, Torben ; Phung, Ivy ; Ray, Rashmi...
Nature Immunology. 25 (2024) 7 - p. 1307-1307 , 2024

Link: https://doi.org/10.1038/..

11

Diamond-structured nanonetwork gold as mechanical metamater..:

Siddique, Suhail K. ; Sadek, Hassan ; Wang, Chi-Wei...
NPG Asia Materials. 15 (2023) 1 - p. , 2023

Link: https://doi.org/10.1038/..

12

Starfish-Inspired Diamond-Structured Calcite Single Crystal..:

Sadek, Hassan ; Siddique, Suhail K. ; Wang, Chi-Wei...
ACS Nano. , 2023

Link: https://doi.org/10.1021/..

13

Rare, convergent antibodies targeting the stem helix broadl..:

Dacon, Cherrelle ; Peng, Linghang ; Lin, Ting-Hui...
Cell Host & Microbe. 31 (2023) 6 - p. 1071-1072 , 2023

Link: https://doi.org/10.1016/..

14

Warpage Estimation of Panel-Level Package from Panel to Str..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Lee, Chang-Chun ; Wang, Chi-Wei ; Chang, Che-Pei. - p. 1969-1972 , 2023

Link: https://doi.org/10.1109/..

15

Warpage Estimation and Demonstration of Panel-Level Fan-Out..:

Lee, Chang-Chun ; Chang, Che-Pei ; Chen, Chin-Yi..
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13 (2023) 4 - p. 560-569 , 2023

Link: https://doi.org/10.1109/..