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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
1
A Novel Polymer-Based Ultra-High Density Bonding Interconne..:
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2022 International Conference on Electronics Packaging (ICEP) ,
2
Characteristic Analysis of a Multi-chip Embedded Interposer..:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
8