Lee, Ching Kuan
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1

A Novel Polymer-Based Ultra-High Density Bonding Interconne..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lin, Yu-Min ; Yang, Tsung-Yu Ou ; Lee, Ou-Hsiang... - p. 1779-1784 , 2023
 
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2

Characteristic Analysis of a Multi-chip Embedded Interposer..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Lee, Ching Kuan ; Liu, Wen-Hung ; Chang, Shu-Yi... - p. 55-56 , 2022
 
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4

A Facile Synthesis of Unusual Liquid-Crystalline Gold(I) Di..:

Lee, Kwang Ming ; Lee, Ching Kuan ; Lin, Ivan J. B.
Angewandte Chemie International Edition in English.  36 (1997)  17 - p. 1850-1852 , 1997
 
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8

Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
 
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15

Reliability Evaluation for Integrated Glass Interposer:

Lee, Ching-Kuan ; Wang, Jen-Chun ; Chang, Hsiang-Hung.
Transactions of The Japan Institute of Electronics Packaging.  9 (2016)  0 - p. E16-009-1-E16-009-5 , 2016
 
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