Lee, Ching-Kuan
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1

Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
 
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2

Reliability Evaluation for Integrated Glass Interposer:

Lee, Ching-Kuan ; Wang, Jen-Chun ; Chang, Hsiang-Hung.
Transactions of The Japan Institute of Electronics Packaging.  9 (2016)  0 - p. E16-009-1-E16-009-5 , 2016
 
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3

The electrical characterizations of glass interposer for in..:

, In: 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Lee, Ching-Kuan ; Wang, Jen-Chun ; Lin, Yu-Min... - p. 336-339 , 2015
 
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14

Micro-Raman characterization of Ge diffusion and Si stress ..:

Chang, Chun-Wei ; Hong, Min-Hao ; Lee, Wei-Fan...
Journal of Materials Research.  27 (2012)  9 - p. 1314-1323 , 2012
 
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15

Multiwavelength Micro-Raman Characterization of Epitaxial S..:

Chang, Chun-Wei ; Hong, Min-Hao ; Tsai, Ming-Shan...
Journal of Electronic Materials.  41 (2012)  11 - p. 3125-3129 , 2012
 
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