Lee, Eun-Sang
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5

Prediction and Comparison of Electrochemical Machining on S..:

Song, Woo Jae ; Choi, Seung Geon ; Lee, Eun-Sang
Journal of Electrochemical Science and Technology.  10 (2019)  3 - p. 276-283 , 2019
 
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A study of the current density analysis for two type method..:

Choi, Seung-Geon ; Kim, Seong-Hyun ; Choi, Woong-Kirl.
Journal of Mechanical Science and Technology.  31 (2017)  9 - p. 4345-4351 , 2017
 
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Analysis of the current density characteristics in through-..:

JIN, Da-som ; CHUN, Kwang-ho ; LEE, Eun-sang
Chinese Journal of Aeronautics.  30 (2017)  3 - p. 1231-1241 , 2017
 
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Comparison between wire mesh and plate electrodes during wi..:

Chun, Kwang-ho ; Jin, Da-som ; Kim, Seong-hyun.
Journal of Mechanical Science and Technology.  31 (2017)  4 - p. 1851-1859 , 2017
 
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10

Comparison of Aerobic Exercise and Combination Exercise Pro..:

Lee, Eun-Sang ; Kim, Gyeong-Tae ; Lee, Seung-Won
Journal of The Korean Society of Physical Medicine.  11 (2016)  3 - p. 89-96 , 2016
 
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12

A study of the improvement surface roughness and optimum ma..:

Kim, Seong-Hyun ; Choi, Seung-Gun ; Choi, Woong-Kirl.
The International Journal of Advanced Manufacturing Technology.  85 (2015)  9-12 - p. 2313-2324 , 2015
 
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13

The optimum condition selection of electrochemical polishin..:

Choi, Seung-Geon ; Kim, Seong-Hyun ; Choi, Woong-Kirl.
The International Journal of Advanced Manufacturing Technology.  82 (2015)  9-12 - p. 1933-1939 , 2015
 
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14

Effect of pad's surface deformation and oscillation on mono..:

Choi, Woong-Kirl ; Kim, Seong-Hyun ; Choi, Seung-Geon..
International Journal of Precision Engineering and Manufacturing.  15 (2014)  11 - p. 2301-2307 , 2014
 
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15

Evaluation of the wafer polishing pad capacity and lifetime..:

Lee, Eun-Sang ; Cha, Ji-Wan ; Kim, Seong-Hyun
International Journal of Machine Tools and Manufacture.  66 (2013)  - p. 82-94 , 2013
 
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