Lee, Gi-Jun
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1

Discharge behavior of spherical and rock chip mucks by scre..:

Lee, Gi-Jun ; Kwon, Tae-Hyuk
Tunnelling and Underground Space Technology.  142 (2023)  - p. 105407 , 2023
 
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2

Investigation of the various properties of several candidat..:

Lee, Gi-Jun ; Yoon, Seok ; Kim, Taehyun.
Nuclear Engineering and Technology.  55 (2023)  3 - p. 1191-1198 , 2023
 
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3

The influence of air gaps on buffer temperature within an e..:

Yoon, Seok ; Lee, Gi-Jun
Nuclear Engineering and Technology.  55 (2023)  11 - p. 4120-4124 , 2023
 
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4

Pressure evaluation of a gap space in the engineered barrie..:

Yoon, Seok ; Lee, Gi-Jun ; An, Sangjun
Case Studies in Thermal Engineering.  50 (2023)  - p. 103458 , 2023
 
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6

Thermal conductivity evaluation for bentonite buffer materi..:

Yoon, Seok ; Lee, Gi-Jun ; Park, Tae-Jin..
Case Studies in Thermal Engineering.  30 (2022)  - p. 101792 , 2022
 
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7

Monitoring of construction-induced urban ground deformation..:

Ramirez, Ryan A. ; Lee, Gi-Jun ; Choi, Shin-Kyu...
International Journal of Applied Earth Observation and Geoinformation.  108 (2022)  - p. 102721 , 2022
 
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8

Evaluation on the buffer temperature by thermal conductivit..:

Yoon, Seok ; Kim, Min-Jun ; Chang, Seeun.
Nuclear Engineering and Technology.  54 (2022)  11 - p. 4005-4012 , 2022
 
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9

Linear thermal expansion behavior of compacted bentonite bu..:

Yoon, Seok ; Lee, Gi-Jun ; Go, Gyu-Hyun
Case Studies in Thermal Engineering.  32 (2022)  - p. 101889 , 2022
 
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11

A Newly Developed State-of-the-Art Full-Scale Excavation Te..:

Lee, Gi-Jun ; Ryu, Hee-Hwan ; Kwon, Tae-Hyuk...
KSCE Journal of Civil Engineering.  25 (2021)  12 - p. 4856-4867 , 2021
 
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13

28.1 A Fully Integrated, Domino-Like-Buffered Analog LDO Ac..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Lee, Jun-Gi ; Bae, Hong-Hyun ; Jang, Seunghyun. - p. 456-458 , 2024
 
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14

An Output-Capacitor-Free Adaptive-Frequency Digital LDO wit..:

, In: 2023 IEEE International Symposium on Circuits and Systems (ISCAS),
Min, Dong-Jick ; Lee, Jun-Gi ; Cho, Kunhee. - p. 1-5 , 2023
 
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