Lee, Hsin-Chia
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4

Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Ou-Hsiang ; Chiu, Wei-Lan ; Chang, Hsiang-Hung... - p. 1863-1867 , 2024
 
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Electroencephalography Connectivity Assesses Cognitive Diso..:

Tseng, Yi-Li ; Liu, Hong-Hsiang ; Chiu, Yen-Nan...
IEEE Transactions on Cognitive and Developmental Systems.  16 (2024)  2 - p. 782-793 , 2024
 
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9

Negative-Tone Photosensitive Polymeric Bonding Material to ..:

Lee, Chia-Hsin ; Tan, Chung-An ; Fowler, Michelle...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  8 - p. 1316-1323 , 2023
 
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3D-Cultured Adipose-Derived Stem Cell Spheres Using Calcium..:

Lin, Yu-Ying ; Kuan, Che-Yung ; Chang, Chia-Tien...
International Journal of Molecular Sciences.  24 (2023)  8 - p. 7062 , 2023
 
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11

Game-Based Social Interaction Platform for Cognitive Assess..:

Chien, Yi-Ling ; Lee, Chia-Hsin ; Chiu, Yen-Nan...
IEEE Transactions on Neural Systems and Rehabilitation Engineering.  31 (2023)  - p. 749-758 , 2023
 
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12

Characteristic Analysis of a Multi-chip Embedded Interposer..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Lee, Ching Kuan ; Liu, Wen-Hung ; Chang, Shu-Yi... - p. 55-56 , 2022
 
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13

Study of Bondable Laser Release Material Using 355 nm Energ..:

Lee, Chia-Hsin ; Huang, Baron ; See, Jennifer...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  4 - p. 692-699 , 2022
 
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14

A hybrid bonding interconnection with a novel low-temperatu..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lin, Yu-Min ; Chang, Po-Chih ; Lee, Ou-Hsiang... - p. 2128-2134 , 2022
 
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15

Flame Recognition System Using YoLo:

, In: Lecture Notes in Electrical Engineering; Frontier Computing,
Yang, Chao-Tung ; Lin, Wen-Yen ; Chen, Yi-Chun.. - p. 239-246 , 2021
 
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