Search for persons
X
?
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
4
Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:
, In:
?
2022 International Conference on Electronics Packaging (ICEP) ,
12
Characteristic Analysis of a Multi-chip Embedded Interposer..:
, In:
?
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
14
A hybrid bonding interconnection with a novel low-temperatu..:
, In:
?
Lecture Notes in Electrical Engineering; Frontier Computing ,
15