Lee, Hye Min
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2

Solder Joint Degradation and Electrochemical Metallic Ion M..:

Lee, Hye Min ; Kim, Mi-Song ; Hong, Won Sik
Journal of Welding and Joining.  41 (2023)  4 - p. 265-274 , 2023
 
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3

Thickness Tolerance in Large-Area Organic Photovoltaics wit..:

Yeop, Jiwoo ; Park, Kwang Hun ; Rasool, Shafket...
ACS Applied Materials & Interfaces.  16 (2023)  1 - p. 704-711 , 2023
 
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5

Bonding Property of Flip-Chip Chip-Scale Package with Vacuu..:

Hyun, So-Hee ; Lee, Hye Min ; Kim, Mi-Song.
Journal of Welding and Joining.  41 (2023)  5 - p. 387-395 , 2023
 
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7

Bonding Property of Middle Temperature Sn-Ag-Cu Solder Ball..:

Bae, Joo Young ; Kim, Mi-Song ; Lee, Hye Min...
Journal of Welding and Joining.  41 (2023)  5 - p. 379-386 , 2023
 
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8

User Reaction to AI Interview: Focusing on Emotion and Inte..:

, In: Communications in Computer and Information Science; HCI International 2023 Posters,
Lee, Hye Min ; Sah, Young June - p. 619-625 , 2023
 
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12

Mechanisms of Advective and Tidal Oscillatory Salt Transpor..:

Lee, Hye Min ; Kim, Jong Wook ; Woo, Seung-Buhm
Journal of Marine Science and Engineering.  11 (2023)  2 - p. 287 , 2023
 
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13

Hierarchically engineered unibody Au mesh for stretchable a..:

Lee, Hye Min ; Kim, Min Ha ; Jin, Yusung...
Journal of Materials Chemistry A.  11 (2023)  8 - p. 4220-4229 , 2023
 
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