Lee, Jackson
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1

Underfill Selection Guideline for Fan-Out Heterogeneous Int..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Teng, Wen-Yu ; Hung, Liang-Yih ; Lee, Jackson... - p. 1993-1997 , 2024
 
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2

Stress and Reliability of Underfills in Heterogeneous Integ..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Teng, Wen-Yu ; Lee, Jackson ; Hung, Liang-Yih.. - p. 235-236 , 2023
 
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5

Effect of Underfill Additive Agents on Crack Prevention in ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Chen, Ching-Chia ; Teng, Wen-Yu ; Tsai, Fang Lin... - p. 477-480 , 2022
 
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6

Stress and Reliability Challenges of Underfills in Large-Si..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Teng, Wen-Yu ; Lee, Jackson ; Tseng, Hsin-Ming... - p. 225-226 , 2022
 
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7

THE SYNTHETIC GLYCAN KB295 OPTIMIZES MICROBIOME COMPOSITION..:

Meisner, Jeffrey ; Bransford, Toni ; Miller, Kelsey...
Inflammatory Bowel Diseases.  28 (2022)  Supplement_1 - p. S70-S71 , 2022
 
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11

Better Warpage Control by Using Low Temperature Solder for ..:

, In: 2021 International Conference on Electronics Packaging (ICEP),
Lai, Da-Sheng ; Lee, Jackson ; Huang, Joe. - p. 135-136 , 2021
 
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12

1208. Development of a Novel Synthetic Glycan to Prevent Ba..:

Meisner, Jeffrey ; Lee, Jackson ; Lawrence, Jonathan..
Open Forum Infectious Diseases.  7 (2020)  Supplement_1 - p. S626-S626 , 2020
 
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15

Mincing words: Balancing recovery and deletion in word trun..:

Pham, Mike ; Lee, Jackson L.
Glossa: a journal of general linguistics; Volume 3.  3 (2018)  1 - p. , 2018
 
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