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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Underfill Selection Guideline for Fan-Out Heterogeneous Int..:
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2023 International Conference on Electronics Packaging (ICEP) ,
2
Stress and Reliability of Underfills in Heterogeneous Integ..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
5
Effect of Underfill Additive Agents on Crack Prevention in ..:
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2022 International Conference on Electronics Packaging (ICEP) ,
6
Stress and Reliability Challenges of Underfills in Large-Si..:
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2021 International Conference on Electronics Packaging (ICEP) ,
11