Lee, Kangwook
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1

Optimized combination of Cervus nippon (Sika deer), Angelic..:

Pan, Jeong Hoon ; Lee, Min Kook ; Chang, Moon Han...
Food Science and Biotechnology.  33 (2024)  7 - p. 1671-1683 , 2024
 
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Structural Characterization of 2.5D System in Package Combi..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Byoungdo ; Choi, Jinwoo ; Lee, Sangyong... - p. 643-646 , 2024
 
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5

Mycoproteins and their health‐promoting properties: Fusariu..:

Lee, Daseul ; Pan, Jeong Hoon ; Kim, Dahye...
Comprehensive Reviews in Food Science and Food Safety.  23 (2024)  3 - p. , 2024
 
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6

Vertical Fan Out(VFO) package with enhanced form factor and..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Sung, Ki-Jun ; Eun, Kyoungtae ; Kim, Jae-Min... - p. 34-39 , 2024
 
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7

Hierarchical Deep Reinforcement Learning-Based Propofol Inf..:

Yun, Won Joon ; Shin, Myungjae ; Mohaisen, David..
IEEE Transactions on Neural Networks and Learning Systems.  35 (2024)  2 - p. 2510-2521 , 2024
 
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8

Network pharmacology study to explore the multiple molecula..:

Lee, Kangwook ; Choi, Yu-Jeong ; Lim, Hae-In...
BMC Complementary Medicine and Therapies.  24 (2024)  1 - p. , 2024
 
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9

C2W Hybrid Bonding Interconnect Technology for Higher Densi..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kim, Kibum ; Lim, Sanghyuk ; Jung, Dongwook... - p. 1048-1052 , 2023
 
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10

Federated Learning with Local Fairness Constraints:

, In: 2023 IEEE International Symposium on Information Theory (ISIT),
Zeng, Yuchen ; Chen, Hongxu ; Lee, Kangwook - p. 1937-1942 , 2023
 
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12

Effects of Twin Boundary and Precipitates on Board Level Re..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Yoon, Dal-Jin ; Lee, Byoungdo ; Kim, Jihye... - p. 1091-1094 , 2023
 
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13

Advanced Packaging Technologies in Memory Applications for ..:

, In: 2023 International Electron Devices Meeting (IEDM),
 
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