Lee, Pei-Tzu
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1

Electromigration-induced remarkable intermetallic compound ..:

Lee, Pei-Tzu ; Lee, Cheng-Yu ; Hsieh, Wan-Zhen..
Journal of Materials Research and Technology.  24 (2023)  - p. 3889-3900 , 2023
 
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White X-ray Nanodiffraction Study of Allotropic Phase Trans..:

, In: 2021 International Conference on Electronics Packaging (ICEP),
Lee, Pei-Tzu ; Hsieh, Wan-Zhen ; Lee, Cheng-Yu.. - p. 113-114 , 2021
 
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Synchrotron white Laue nanodiffraction study on the allotro..:

Lee, Pei-Tzu ; Hsieh, Wan-Zhen ; Lee, Cheng-Yu...
Journal of Materials Research and Technology.  13 (2021)  - p. 1316-1322 , 2021
 
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9

Self-Annealing Behavior of Electroplated Cu with Different ..:

Yang, Cheng-Hsien ; Lee, Yu-Wei ; Lee, Cheng-Yu..
Journal of The Electrochemical Society.  167 (2020)  8 - p. 082514 , 2020
 
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Interfacial microstructure and mechanical reliability of th..:

Wu, Ying-Syuan ; Lee, Pei-Tzu ; Huang, Yu-Hsuan..
Surface and Coatings Technology.  350 (2018)  - p. 874-879 , 2018
 
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13

Electromigration in 3D-IC scale Cu/Sn/Cu solder joints:

Ho, Cheng-En ; Lee, Pei-Tzu ; Chen, Chih-Nan.
Journal of Alloys and Compounds.  676 (2016)  - p. 361-368 , 2016
 
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