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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
1
Chip Last Fanout Chip on Substrate (FOCoS) Solution for Chi..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
2
Advanced Fanout Packaging Technology for Hybrid Substrate I..:
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2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
3
Characterization of through glass via (TGV) RF inductors:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
4