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Lee, Yongsu
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1

Demonstration of a low power and high-speed graphene/silico..:

Kwon, Min Gyu ; Kim, Cihyun ; Kim, Seung-Mo...
Nanoscale Advances.  6 (2024)  13 - p. 3391-3398 , 2024
Link: https://doi.org/10.1039/..
 
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2

Ultra-thin and High-quality Pt-Silicidation using CW Laser ..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Kim, Seung Mo ; Kwon, Min Gyu ; Woo, Taekyu... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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3

Area and Device Count Efficient Binary Logic Circuits using..:

Jun, Jae Hyeon ; Lee, Yongsu ; Lee, Hae‐Won...
Advanced Electronic Materials.  , 2024
Link: https://doi.org/10.1002/..
 
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4

Demonstration of p-type stack-channel ternary logic device ..:

Lee, Yongsu ; Kwon, Heejin ; Kim, Seung-Mo...
Nano Convergence.  10 (2023)  1 - p. , 2023
Link: https://doi.org/10.1186/..
 
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5

Demonstration of frequency doubler application using ZnO-DN..:

, In: 2023 35th International Conference on Microelectronic Test Structure (ICMTS),
Lee, Yongsu ; Hwang, Hyeon Jun ; Lee, Byoung Hun - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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6

14‐4: Enhanced Low Temperature Polycrystalline Silicon Thin..:

Jang, Seunghyun ; Son, Byoungtaek ; Sim, Myungbo...
SID Symposium Digest of Technical Papers.  53 (2022)  1 - p. 151-154 , 2022
Link: https://doi.org/10.1002/..
 
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7

VDD scalability of complementary ternary stack channel tran..:

, In: 2022 IEEE Silicon Nanoelectronics Workshop (SNW),
Kim, Kiyung ; Kim, So-Young ; Lee, Yongsu... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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8

Performance Evaluation of Scaled ZnO Stacked Nanosheet Chan..:

Lee, Ho-In ; Kim, So-Young ; Kim, Seung-Mo...
IEEE Electron Device Letters.  43 (2022)  2 - p. 323-326 , 2022
Link: https://doi.org/10.1109/..
 
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9

Dual-channel P-type ternary DNTT–graphene barristor:

Lee, Yongsu ; Kim, Seung-Mo ; Kim, Kiyung...
Scientific Reports.  12 (2022)  1 - p. , 2022
Link: https://doi.org/10.1038/..
 
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10

Demonstration of Anti-ambipolar Switch and Its Applications..:

Lee, Yongsu ; Kim, Sunmean ; Lee, Ho-In...
ACS Nano.  16 (2022)  7 - p. 10994-11003 , 2022
Link: https://doi.org/10.1021/..
 
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11

5‐3: Experimental and Physics‐Based Analysis of Leakage Cur..:

Kim, Keunwoo ; Kim, Hanbit ; Chu, Jaehwan...
SID Symposium Digest of Technical Papers.  52 (2021)  1 - p. 37-40 , 2021
Link: https://doi.org/10.1002/..
 
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12

Non-destructive defect level analysis of graphene using amp..:

Kim, Seung-Mo ; Lee, Ho-In ; Lee, Yongsu...
Carbon.  179 (2021)  - p. 627-632 , 2021
Link: https://doi.org/10.1016/..
 
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13

Operation Principles of ZnO/Al2O3‐AlDMP/ZnO Stacked‐Channel..:

Kim, So‐Young ; Kim, Kiyung ; Kim, A. Reum...
Advanced Electronic Materials.  7 (2021)  6 - p. , 2021
Link: https://doi.org/10.1002/..
 
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14

Copper-graphene heterostructure for back-end-of-line compat..:

Son, Myungwoo ; Jang, Jaewon ; Lee, Yongsu...
npj 2D Materials and Applications.  5 (2021)  1 - p. , 2021
Link: https://doi.org/10.1038/..
 
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15

5‐2: Enhanced Bending Endurance with Transverse Tensile Str..:

Lee, Jaeseob ; Lee, Yongsu ; Kang, Taewook...
SID Symposium Digest of Technical Papers.  52 (2021)  1 - p. 33-36 , 2021
Link: https://doi.org/10.1002/..
 
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