E-LIB Suche - Ergebnisse für: Lefranc, Pierre

1

Flip-Chip Low inductive and EMC optimized PCB Power Module:

, In: 2024 IEEE Applied Power Electronics Conference and Exposition (APEC),

Abed Ali, Fatme ; Jeannin, Pierre-Olivier ; Avenas, Yvan. - p. 1534-1538 , 2024

2

Advanced voltage balancing techniques for series-connected ..:

Alves, Luciano F.S. ; Lefranc, Pierre ; Jeannin, Pierre-Olivier.
Power Electronic Devices and Components. 7 (2024) - p. 100055 , 2024

Link: https://doi.org/10.1016/..

3

Leading LCA result interpretation towards efficient ecodesi..:

Fang, Li ; Quisbert-Trujillo, Ernesto ; Lefranc, Pierre.
Procedia CIRP. 122 (2024) - p. 731-736 , 2024

Link: https://doi.org/10.1016/..

4

Disassemblability Assessment of Power Electronic Converters..:

Turkbay Romano, Tugce ; Fang, Li ; Alix, Thècle...
Sustainability. 16 (2024) 11 - p. 4712 , 2024

Link: https://doi.org/10.3390/..

5

Barriers for eco-designing circular Power Electronics Conve..:

Fang, Li ; Lefranc, Pierre ; Rio, Maud
Procedia CIRP. 116 (2023) - p. 287-292 , 2023

Link: https://doi.org/10.1016/..

6

Design of an Integrated Power Module for Silicon Carbide MO..:

Abed Ali, Fatme ; Avenas, Yvan ; Lefranc, Pierre...
Materials Science Forum. 1062 (2022) - p. 637-641 , 2022

Link: https://doi.org/10.4028/..

7

Experimental Investigation of a 10 kV-70A Switch with Six S..:

Mathieu de Vienne, Cédric ; Lefranc, Pierre ; Asllani, Besar..
Materials Science Forum. 1062 (2022) - p. 472-476 , 2022

Link: https://doi.org/10.4028/..

8

A New Gate Drive Power Supply Configuration for Common Mode..:

Alves, Luciano F. S. ; Lefranc, Pierre ; Jeannin, Pierre-Olivier.
IEEE Transactions on Power Electronics. 36 (2021) 4 - p. 4081-4090 , 2021

Link: https://doi.org/10.1109/..

9

Diamond semiconductor performances in power electronics app..:

Perez, Gaëtan ; Maréchal, Aurélien ; Chicot, Gauthier...
Diamond and Related Materials. 110 (2020) - p. 108154 , 2020

Link: https://doi.org/10.1016/..

10

Analysis of the Multi-Steps Package (MSP) for Series-Connec..:

Alves, Luciano F. S. ; Lefranc, Pierre ; Jeannin, Pierre-Olivier..
Electronics. 9 (2020) 9 - p. 1341 , 2020

Link: https://doi.org/10.3390/..

11

High-voltage and high-frequency design of planar transforme..:

, In: 2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe),

Spro, Ole Christian ; Peftitsis, Dimosthenis ; Lefranc, Pierre - p. P.1-P.10 , 2019

Link: https://doi.org/10.23919..

12

Gate Driver Supply Architectures for Common Mode Conducted ..:

Nguyen, Van-Sang ; Lefranc, Pierre ; Crebier, Jean-Christophe
IEEE Transactions on Power Electronics. 33 (2018) 12 - p. 10265-10276 , 2018

Link: https://doi.org/10.1109/..

13

Integrated temperature sensor with diamond Schottky diodes ..:

Perez, Gaëtan ; Chicot, Gauthier ; Avenas, Yvan...
Diamond and Related Materials. 78 (2017) - p. 83-87 , 2017

Link: https://doi.org/10.1016/..

14

Design methodology for very high insulation voltage capabil..:

Am, Sokchea ; Lefranc, Pierre ; Frey, David.
IET Power Electronics. 10 (2017) 5 - p. 545-554 , 2017

Link: https://doi.org/10.1049/..

15

SIC power devices in power electronics: An overview:

, In: 2017 Brazilian Power Electronics Conference (COBEP),

Alves, Luciano F. S. ; Gomes, Ruan C. M. ; Lefranc, Pierre... - p. 1-8 , 2017

Link: https://doi.org/10.1109/..