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Leong Ching Wai, Eva
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1

Investigation of Void-free Chip-to-Chip Bonding Methods for..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Yeo, Yi Xuan ; Leong Ching Wai, Eva ; Chen, Daniel Ssu-Han. - p. 869-872 , 2023
Link: https://doi.org/10.1109/..
 
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2

Demonstration of Vertically Integrated POP using FOWLP Appr..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Chong, Ser Choong ; Wai Leong Ching, Eva ; Pei Siang, Sharon Lim.. - p. 873-878 , 2020
Link: https://doi.org/10.1109/..
 
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3

Thermo-mechanical design of fan-out wafer level package for..:

, In: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC),
Chen, Zhaohui ; Gongyue, Tang ; Long, Lau Boon... - p. 1-6 , 2017
Link: https://doi.org/10.1109/..
 
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4

High-Performance Amplifier Package Design for Heterogenous ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lim, Teck Guan ; Zho, Lin ; Tippabhotla, Sasi Kumar... - p. 1838-1843 , 2023
Link: https://doi.org/10.1109/..
 
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5

Comprehensive Study on the Encapsulation for the Intelligen..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Lim, Simon Siak Boon ; Ching, Eva Wai Leong ; Yamamoto, Kazunori. - p. 555-559 , 2019
Link: https://doi.org/10.1109/..
 
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6

Silicon Optical Electrical Interposer - Fiber to the Chip:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Guan, Lim Teck ; Yu, Li Hong ; Chinq, Jong Ming... - p. 34-39 , 2019
Link: https://doi.org/10.1109/..
 
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7

Magnetic Shielding and Packaging of STT MRAM:

, In: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC),
Guan, Lim Teck ; Ching, Eva Wai Leong ; Yi, Lim Wei... - p. 349-354 , 2018
Link: https://doi.org/10.1109/..
 
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8

MEMS-Silicon Chip Bonding Verification using GHz Pulse-echo..:

, In: 2023 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFCS),
Trivedi, Shyam ; Yeo, Yi Xuan ; Sarafianou, Mantalena... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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9

Recent Advances and Challenges of 2D Fourier Transform Comp..:

, In: 2023 IEEE 23rd International Conference on Nanotechnology (NANO),
Chen, Daniel Ssu-Han ; Teo, Yong Shun ; Yeo, Yi Xuan... - p. 1042-1047 , 2023
Link: https://doi.org/10.1109/..
 
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10

A Study of Bonding Materials for GHz Ultrasonic Wavefront C..:

, In: 2022 IEEE International Ultrasonics Symposium (IUS),
Chen, Daniel Ssu-Han ; Sarafianou, Mantalena ; Wai, Eva Leong Ching... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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11

Development and Demonstration of a Novel Immersion Two Phas..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Tang, Gongyue ; Wai, Leong Ching ; Feng, Huicheng - p. 1553-1558 , 2023
Link: https://doi.org/10.1109/..
 
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12

Transient Thermal Characterization and Analysis for Next Ge..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Tang, Gongyue ; Ye, Yong Liang ; Ching Wai, Leong. - p. 244-248 , 2023
Link: https://doi.org/10.1109/..
 
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13

Development of Flip-Chip Packaging for Monolithic Microwave..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Wai, Leong Ching ; Guan Lim, Teck ; Chong, Ser Choong. - p. 455-458 , 2023
Link: https://doi.org/10.1109/..
 
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14

Attachment of Alignment Fibre on Interposer for Fibre Optic..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Wai, Leong Ching ; Lim, Teck Guan ; Chong, Ser Choong. - p. 128-133 , 2022
Link: https://doi.org/10.1109/..
 
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15

Pressure-assist Silver Sintering Paste for SiC Power Device..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Wai, Leong Ching ; Yamamoto, Kazunori ; Tang, Gongyue. - p. 2211-2216 , 2022
Link: https://doi.org/10.1109/..
 
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