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Lho, Daehwan
31  results:
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1

Bayesian Optimization based Fast and Accurate Wireless Powe..:

, In: 2023 IEEE Wireless Power Technology Conference and Expo (WPTCE),
Sim, Boogyo ; Shin, Taein ; Park, Hyunwook... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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2

SI/PI Co-Design of 12.8 Gbps HBM I/O Interface using Bayesi..:

, In: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI),
Shin, Taein ; Park, Hyunwook ; Lho, Daehwan... - p. 662-667 , 2023
Link: https://doi.org/10.1109/..
 
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3

Reinforcement-Learning-Based Signal Integrity Optimization ..:

Son, Kyungjune ; Kim, Minsu ; Park, Hyunwook...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  1 - p. 100-110 , 2022
Link: https://doi.org/10.1109/..
 
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4

Power Distribution Network Impedance Analysis considering T..:

, In: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
Son, Keeyoung ; Lho, Daehwan ; Kim, Keunwoo... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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5

Intra-pair Skew Impact Analysis of High-speed Cables for HD..:

, In: 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Sim, Boogyo ; Kim, Keunwoo ; Shin, Taein... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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6

Deterministic Policy Gradient-based Reinforcement Learning ..:

, In: 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Lho, Daehwan ; Park, Hyunwook ; Kim, Keunwoo... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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7

Scalable Transformer Network-based Reinforcement Learning M..:

, In: 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Park, Hyunwook ; Shin, Taein ; Kim, Seongguk... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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8

Signal Integrity and Power Leakage Optimization for 3D X-Po..:

, In: 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Son, Kyungjune ; Kim, Keunwoo ; Park, Gapyeol... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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9

Thermal Analysis of DDR5 DIMM with Forced Air Cooling Metho:

, In: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
Son, Keeyoung ; Lho, Daehwan ; Kim, Seongguk... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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10

Modeling and Signal Integrity Analysis of Mounting Pad with..:

, In: 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Kim, Hyunwoong ; Kim, Jongwook ; Song, Kyunghwan... - p. 1-3 , 2021
Link: https://doi.org/10.1109/..
 
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11

A Deep Neural Network-based Estimation of EMI Reduction by ..:

, In: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI),
Sim, Boogyo ; Lho, Daehwan ; Park, Dongryul... - p. 407-410 , 2020
Link: https://doi.org/10.1109/..
 
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12

Deep Neural Network-based Lumped Circuit Modeling using Imp..:

, In: 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
Lho, Daehwan ; Park, Hyunwook ; Kim, Seongguk... - p. 1-3 , 2020
Link: https://doi.org/10.1109/..
 
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13

Segmentation method based modeling and analysis of a glass ..:

Kim, Youngwoo ; Fujimoto, Daisuke ; Kaji, Shugo...
Nonlinear Theory and Its Applications, IEICE.  11 (2020)  2 - p. 170-188 , 2020
Link: https://doi.org/10.1587/..
 
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14

Deep Reinforcement Learning-based Through Silicon Via (TSV)..:

, In: 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
Kim, Keunwoo ; Park, Hyunwook ; Lho, Daehwan... - p. 1-3 , 2020
Link: https://doi.org/10.1109/..
 
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15

An Induction Heating System Analysis Method based on Operat..:

, In: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI),
Kang, Hyungmin ; Lho, Daehwan ; Park, Hyunwook... - p. 478-481 , 2020
Link: https://doi.org/10.1109/..
 
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