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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Packaging Challenges and Solutions for Next Generation Low-..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
2
Ultra-thin Double Side SiP Technology with Embedded Trace S..:
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2024 IEEE International Symposium on Circuits and Systems (ISCAS) ,
7