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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
6
Etching scallop-less nano-TSV with F/O coupling plasma:
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Communications in Computer and Information Science; HCI International 2023 Posters ,
8
Research on the Preference of University Students for the F..:
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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
10
Optimization of Wafer-level TTV Using RIE Applied for the E..:
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ICASSP 2023 - 2023 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) ,
11