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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
3
Development of Multi-Die Stacking with Cu-Cu interconnects ..:
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2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
5
Comprehensive Study of Multi-Die Stacking with CuSnAg bumps..:
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2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
6
Thermal Analysis of 2.5D Package in High Power Application:
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2023 6th International Conference on Applied Computational Intelligence in Information Systems (ACIIS) ,
14