Li, Lim Seow
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3

Development of Multi-Die Stacking with Cu-Cu interconnects ..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Chong, Ser Choong ; Xie, Ling ; Li, Hongyu. - p. 188-193 , 2020
 
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4

Antioxidant and anti-inflammatory properties of Erythroxylu..:

Lim Seow Li ; Samaila Musa Chiroma ; Thuaibah Hashim...
http://www.sciencedirect.com/science/article/pii/S2405844020309853.  , 2020
 
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5

Comprehensive Study of Multi-Die Stacking with CuSnAg bumps..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Chong, Ser Choong ; Li, Hongyu ; Xie, Ling. - p. 349-354 , 2019
 
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6

Thermal Analysis of 2.5D Package in High Power Application:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Han, Yong ; Li, Hongyu ; Lim, Sharon Seow Huang. - p. 402-405 , 2019
 
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14

5G-Wi-SUN for Building Management System:

, In: 2023 6th International Conference on Applied Computational Intelligence in Information Systems (ACIIS),
 
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