Li, Siu Cheung
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4

A Multimodal Data-Driven Framework for Anxiety Screening:

Mo, Haimiao ; Hui, Siu Cheung ; Liao, Xiao...
IEEE Transactions on Instrumentation and Measurement.  73 (2024)  - p. 1-13 , 2024
 
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Voids-free Die-level Cu/ILD Hybrid bonding:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Sakuma, Katsuyuki ; Yu, Roy ; Polomoff, Nicholas... - p. 800-805 , 2023
 
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Direct Die to Wafer Cu Hybrid Bonding for Volume Production:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Fan, Chun Ho ; Ng, Hoi Ping ; So, Siu Cheung... - p. 91-96 , 2023
 
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13

EvidenceNet: Evidence Fusion Network for Fact Verification:

, In: Proceedings of the ACM Web Conference 2022,
Chen, Zhendong ; Hui, Siu Cheung ; Zhuang, Fuzhen... - p. 2636-2645 , 2022
 
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Effective Named Entity Recognition with Boundary-aware Bidi..:

, In: Proceedings of the Web Conference 2021,
Li, Fei ; Wang, Zheng ; Hui, Siu Cheung... - p. 1695-1703 , 2021
 
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