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Li, Wangyun
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1

Counter-intuitive mechanical performance variation in aged ..:

Li, Wangyun ; Mo, Lanqing ; Chen, Feng...
Vacuum.  227 (2024)  - p. 113367 , 2024
Link: https://doi.org/10.1016/..
 
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2

Preparation of NiTip/Al composites with controllable phase ..:

Wu, Xiao ; Jiang, HongJie ; Li, WangYun...
Science China Technological Sciences.  67 (2024)  2 - p. 597-607 , 2024
Link: https://doi.org/10.1007/..
 
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3

Effect of Phase Evolution on Inhomogeneous Deformation and ..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Liang, Shuibao ; Li, Wangyun ; Jiang, Han.. - p. 161-162 , 2024
Link: https://doi.org/10.23919..
 
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4

Developing critical thinking in the transition from undergr..:

Li, Wangyun ; Liao, Guoping ; Khan, I.A....
SHS Web of Conferences.  187 (2024)  - p. 03017 , 2024
Link: https://doi.org/10.1051/..
 
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5

Low‐Temperature Solidifiable Liquid Metal with Ultrahigh Th..:

Zheng, Zenghuang ; Wei, Song ; Yang, Yiren...
Advanced Engineering Materials.  25 (2023)  11 - p. , 2023
Link: https://doi.org/10.1002/..
 
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6

Design and Integration Approach of Low-Inductance Vertical ..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Fan, Yinxiang ; Yan, Haidong ; Yang, Daoguo... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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7

Development of micron-sized Ag-Si composite paste die attac..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chen, Chuantong ; Liu, Yang ; Li, Wangyun... - p. 548-551 , 2023
Link: https://doi.org/10.1109/..
 
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8

Minor Ag induced shear performance alternation in BGA struc..:

Li, Wangyun ; Mo, Lanqing ; Li, Xingmin...
Journal of Materials Research and Technology.  25 (2023)  - p. 6111-6122 , 2023
Link: https://doi.org/10.1016/..
 
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9

Rapid silver sinter joining technology for large area chips:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Zhang, Luobin ; Chen, Chuantong ; Huo, Fupeng.. - p. 249-250 , 2023
Link: https://doi.org/10.23919..
 
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10

Fine Pitch Micro Via Interconnection with Reliable Electrol..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Hsieh, Ming-Chun ; Zhang, Zheng ; Nishijima, Masahiko... - p. 1381-1384 , 2023
Link: https://doi.org/10.1109/..
 
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11

A Wire-less SiC Power Module Using Flip-Chip Sintering Meth..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Liu, Yuncan ; Yan, Haidong ; Yang, Daoguo... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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12

Development of high thermal conductivity of Ag/diamond comp..:

Xu, Yuxin ; Qiu, Xiaoming ; Li, Wangyun...
Journal of Materials Research and Technology.  26 (2023)  - p. 1079-1093 , 2023
Link: https://doi.org/10.1016/..
 
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13

Elevated damping properties of lead-free solders under elec..:

Li, Wangyun ; Liu, Linqiang
Scripta Materialia.  226 (2023)  - p. 115230 , 2023
Link: https://doi.org/10.1016/..
 
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14

High reliability design Ag sinter joining on softened Ni-P ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chen, Chuantong ; Liu, Yang ; Li, Wangyun... - p. 651-655 , 2023
Link: https://doi.org/10.1109/..
 
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15

Phase transition and damping behavior of Al matrix composit..:

Ding, Chaoyi ; Jiang, Hongjie ; Li, Wangyun...
Journal of Materials Science.  58 (2023)  45 - p. 17257-17274 , 2023
Link: https://doi.org/10.1007/..
 
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