E-LIB Suche - Ergebnisse für: Li-Yin, Gao

1

The development of porous metallic materials: a short revie..:

Li-Yin, Gao ; Hao-Kun, Yang ; Xuan, Chen...
Physica Scripta. 98 (2023) 12 - p. 122001 , 2023

Link: https://doi.org/10.1088/..

2

Effect of impurities on anisotropic grain growth in (111)-o..:

Zhang, Minghui ; Gao, Li-Yin ; Zhang, Qi...
Materials Characterization. 214 (2024) - p. 114056 , 2024

Link: https://doi.org/10.1016/..

3

Micro-cones Cu fabricated by pulse electrodeposition for so..:

Zhang, Minghui ; Gao, Li-Yin ; Wang, Yu-Xi...
Applied Surface Science. 650 (2024) - p. 159184 , 2024

Link: https://doi.org/10.1016/..

4

The mechanical property and microstructural thermal stabili..:

Zhang, Yu-Bo ; Gao, Li-Yin ; Tao, Jun-Lei...
Materials Today Communications. 38 (2024) - p. 108182 , 2024

Link: https://doi.org/10.1016/..

5

Significant inhibition of interfacial Cu6Sn5 IMC and improv..:

Lu, Xiao ; Zhang, Liang ; Liu, Zhi-Quan...
Materials Characterization. 208 (2024) - p. 113668 , 2024

Link: https://doi.org/10.1016/..

6

Extremely Low Contact Resistivity of Bi2Te3-Based Modules E..:

Min, Erbiao ; Ling, Yifeng ; Zhao, Linghao...
ACS Applied Materials & Interfaces. 15 (2023) 50 - p. 59066-59074 , 2023

Link: https://doi.org/10.1021/..

7

Study on the dual inhibition behavior of interfacial IMCs i..:

Lu, Xiao ; Zhang, Liang ; Guo, Yong-huan...
Journal of Materials Research and Technology. 25 (2023) - p. 3754-3767 , 2023

Link: https://doi.org/10.1016/..

8

Synthesis of Cu Nanowires by Template Electrodeposition and..:

Meng, Zhi-Chao ; Gao, Li-Yin ; Liu, Zhi-Quan
Journal of Electronic Materials. 52 (2023) 5 - p. 3463-3471 , 2023

Link: https://doi.org/10.1007/..

9

Effects of additive interactions on electroplating profile ..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),

Li, Xiao ; Li, Zhe ; Gao, Li-Yin.. - p. 1-6 , 2023

Link: https://doi.org/10.1109/..

10

Characterization of Cu-Cu direct bonding in ambient atmosph..:

Zhang, Minghui ; Gao, Li-Yin ; Li, Jun-Jie..
Materials Chemistry and Physics. 306 (2023) - p. 128089 , 2023

Link: https://doi.org/10.1016/..

11

Prospective application of nanotwinned copper for Damascene..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),

Gao, Li-Yin ; Wan, Yong-Qiang ; Lei, Zhi-Gang... - p. 1-6 , 2023

Link: https://doi.org/10.1109/..

12

The influence of pattern size on the profile and microstruc..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),

Liu, Jin-Hao ; Gao, Li-Yin ; Cui, Xian-Wei.. - p. 1-5 , 2023

Link: https://doi.org/10.1109/..

13

Research Progress of Electroplated Nanotwinned Copper in Mi..:

Chen, Ke-Xin ; Gao, Li-Yin ; Li, Zhe..
Materials. 16 (2023) 13 - p. 4614 , 2023

Link: https://doi.org/10.3390/..

14

Copper electroplating of through silicon vias (TSV) using a..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),

Chen, Ke-Xin ; Gao, Li-Yin ; Sun, Rong. - p. 1-5 , 2023

Link: https://doi.org/10.1109/..

15

Study on the dual inhibition behavior of interfacial IMCs i..:

Xiao Lu ; Liang Zhang ; Yong-huan Guo...
http://www.sciencedirect.com/science/article/pii/S2238785423014229. , 2023

Link: https://doi.org/10.1016/..