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2017 18th International Conference on Electronic Packaging Technology (ICEPT) ,
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Study on the electrical performance of Au bump in FC cerami..:
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2016 17th International Conference on Electronic Packaging Technology (ICEPT) ,
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Study on the electrical performance of one differential pai..:
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2016 17th International Conference on Electronic Packaging Technology (ICEPT) ,
5
The finite element analysis on reliability of gold bump:
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2015 16th International Conference on Electronic Packaging Technology (ICEPT) ,
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Design and simulation of CCGA AlN ceramic package:
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2015 16th International Conference on Electronic Packaging Technology (ICEPT) ,
7