Lian, Binhao
15  results:
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1

The Mechanical Analysis of Sn-Base Bump:

Yang, Jun ; Yao, Quanbin ; Lin, Pengrong..
IOP Conference Series: Materials Science and Engineering.  612 (2019)  5 - p. 052042 , 2019
 
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3

Study on the electrical performance of Au bump in FC cerami..:

, In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT),
Lu, Feng ; Hu, Peifeng ; Ding, Yajun... - p. 1517-1519 , 2017
 
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4

Study on the electrical performance of one differential pai..:

, In: 2016 17th International Conference on Electronic Packaging Technology (ICEPT),
Lu, Feng ; Cao, Yusheng ; Lian, Binhao - p. 1327-1329 , 2016
 
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5

The finite element analysis on reliability of gold bump:

, In: 2016 17th International Conference on Electronic Packaging Technology (ICEPT),
Liu, Jiansong ; Yao, Quanbin ; Lin, Pengrong.. - p. 1330-1333 , 2016
 
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6

Design and simulation of CCGA AlN ceramic package:

, In: 2015 16th International Conference on Electronic Packaging Technology (ICEPT),
Lu, Feng ; Deng, Zhijie ; Cao, Yusheng. - p. 1325-1328 , 2015
 
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7

Electrical simulation of gold bonding wire with different p..:

, In: 2015 16th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Dejing ; Zhao, Yuanfu ; Yao, Quanbin... - p. 1329-1333 , 2015
 
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9

Enhanced Photocurrent and Photocatalytic Performance of a π..:

Li, Binhao ; Zhang, Duoping ; Liu, Baotong...
ACS Applied Energy Materials.  6 (2023)  21 - p. 11331-11341 , 2023
 
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10

Identification and characterization of eight metallothionei..:

Liu, Binhao ; Dong, Pengcheng ; Zhang, Xinzhe...
Environmental Science and Pollution Research.  29 (2021)  10 - p. 14430-14442 , 2021
 
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11

Metagenomic insights into the effects of submerged plants o..:

Wang, Binhao ; Zheng, Xiafei ; Zhang, Hangjun...
Marine Life Science & Technology.  3 (2021)  4 - p. 405-415 , 2021
 
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