Liang, Chia-Wei
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1

Fan-out panel-level package warpage and reliability analyse..:

Liang, Chia-Wei ; Sung, Yu-Chi ; Hwang, Sheng-Jye...
Journal of Manufacturing Processes.  119 (2024)  - p. 649-665 , 2024
 
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SEM-latch : a lost-cost and high-performance latch desig..:

, In: Proceedings of the 59th ACM/IEEE Design Automation Conference,
 
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A probabilistic model for reducing medication errors: A sen..:

Huang, Chu-Ya ; Nguyen, Phung-Anh ; Yang, Hsuan-Chia...
Computer Methods and Programs in Biomedicine.  170 (2019)  - p. 31-38 , 2019
 
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Application of TOWS Matrix Analysis in a Precision Medicine..:

, In: Innovative Mobile and Internet Services in Ubiquitous Computing; Lecture Notes in Networks and Systems,
Wang, Kuei-Yuan ; Lin, Ying-Li ; Han, Chien-Kuo. - p. 366-375 , 2022
 
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Resistor-Based Temperature Sensing Chip with Digital Output:

, In: 2020 International Symposium on VLSI Design, Automation and Test (VLSI-DAT),
 
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11

Analysis of Success Factors of Introducing SAP System for E..:

Wei, Hsin-Ju ; Wei, Chia-Liang
International Journal of Digital Library Systems.  2 (2011)  1 - p. 1-37 , 2011
 
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13

Acupuncture improves neurological function and anti-inflamm..:

Tsai, Chueh-Yi ; Liao, Wen-Ling ; Wu, Hung-Ming...
Complementary Therapies in Medicine.  82 (2024)  - p. 103049 , 2024
 
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A Testbed for Cryogenic On-wafer Noise Measurement Using Co..:

, In: 2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS),
 
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