Liang, Jifan
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1

How to Evaluate Semantic Communications for Images With ViT..:

Zhu, Tingting ; Peng, Bo ; Liang, Jifan...
IEEE Transactions on Cognitive Communications and Networking.  , 2024
 
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2

A New Joint Source-Channel Coding for Short-Packet Communic..:

Wang, Qianfan ; Chen, Yanzhi ; Liang, Jifan.
IEEE Transactions on Communications.  72 (2024)  1 - p. 28-37 , 2024
 
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3

A Low-Complexity Ordered Statistic Decoding of Short Block ..:

Liang, Jifan ; Wang, Yiwen ; Cai, Suihua.
IEEE Communications Letters.  27 (2023)  2 - p. 400-403 , 2023
 
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4

A New Joint Source-Channel Coding in the Short Blocklength ..:

, In: 2023 IEEE Globecom Workshops (GC Wkshps),
Wang, Qianfan ; Chen, Yanzhi ; Liang, Jifan.. - p. 1566-1571 , 2023
 
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5

A New Joint Source-Channel Coding Scheme with Overlay Sprea..:

, In: 2023 International Conference on Wireless Communications and Signal Processing (WCSP),
Chen, Yanzhi ; Liang, Jifan ; Wang, Qianfan. - p. 239-244 , 2023
 
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6

A New JSCC Scheme for Transmission of Gaussian Sources Over..:

, In: 2023 IEEE/CIC International Conference on Communications in China (ICCC),
Liang, Jifan ; Zhu, Tingting ; Wei, Baodian. - p. 1-6 , 2023
 
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7

Lossy Compression of Gaussian Source Using Low Density Gene..:

, In: 2022 Data Compression Conference (DCC),
Zhu, Tingting ; Liang, Jifan ; Ma, Xiao - p. 498-498 , 2022
 
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8

Local Constraint-Based Ordered Statistics Decoding for Shor..:

, In: 2022 IEEE Information Theory Workshop (ITW),
Wang, Yiwen ; Liang, Jifan ; Ma, Xiao - p. 107-112 , 2022
 
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9

Ternary Convolutional LDGM Codes with Applications to Gauss..:

, In: 2022 IEEE International Symposium on Information Theory (ISIT),
Zhu, Tingting ; Liang, Jifan ; Ma, Xiao - p. 73-78 , 2022
 
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10

Halftone Image Steganalysis by Reconstructing Grayscale Ima..:

, In: Lecture Notes in Computer Science; Artificial Intelligence and Security,
Luo, Junwei ; Lin, Cong ; Zeng, Lingwen.. - p. 412-423 , 2021
 
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14

The Topological Hall Effect in CoGd Films Controlled by Hyd..:

Ren, Xue ; Liu, Liang ; Cui, Bin...
Advanced Electronic Materials.  10 (2024)  5 - p. , 2024
 
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