Liang, Kuo-Sheng
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2

Thermal Challenges for HPC 3DIC Packages and Systems:

, In: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Yan, Kathy ; Lin, Po-Yao ; Kuo, Sheng-Liang - p. 151-153 , 2022
 
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3

Advanced Thermal Integration for HPC Packages with Two-Phas..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lin, Po-Yao ; Kuo, Sheng-Liang ; Yan, Kathy.. - p. 566-573 , 2022
 
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4

Thermal Characteristics of Integrated Fan-Out on Substrate ..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Hsu, Chia-Hao ; Lin, Yi-Jou ; Kuo, Sheng-Liang... - p. 212-218 , 2020
 
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5

Leakage-Aware Dynamic Compact Thermal Model for CMOS Techno..:

, In: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Pan, Chi-Wen ; Huang, Pei-Yu ; Hsu, Chia-Hao.. - p. 355-361 , 2019
 
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7

Genetic Risk Loci and Familial Associations in Migraine: A ..:

Liu, Yi ; Yeh, Po-Kuan ; Lin, Yu-Kai...
Journal of Clinical Neurology.  20 (2024)  4 - p. 439 , 2024
 
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Dual-Polarized Patch Array Antennas with Wide Beamwidth for..:

, In: 2023 Asia-Pacific Microwave Conference (APMC),
Hsu, Pei-Hsin ; Liao, Chao-Hsiang ; Sun, Jwo-Shiun... - p. 254-256 , 2023
 
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14

An Innovative Customized Biomimetic Hydrogel for Drug Scree..:

Ou, Keng-Liang ; Huang, Chiung-Fang ; Lan, Wen-Chien...
International Journal of Molecular Sciences.  23 (2022)  3 - p. 1488 , 2022
 
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