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Lih-Tyng Hwang
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1

The effects of the density extremum and boundary conditions..:

Lih-tyng, Hwang ; Wen-feng, Lu ; Mollendorf, J.C.
International Journal of Heat and Mass Transfer.  27 (1984)  4 - p. 497-510 , 1984
Link: https://doi.org/10.1016/..
 
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2

Frequency Selective Surface (FSS) Based Antenna Array Desig..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Hwang, Lih-Tyng ; Huang, Ming-Yuan ; Lin, Hung-Chih - p. 1858-1865 , 2023
Link: https://doi.org/10.1109/..
 
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3

Analysis of the Slot on a Dual-Band Antenna:

, In: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
Yang, Chi-Hau ; Ciou, Yi-Ting ; Hwang, Lih-Tyng - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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4

High Gain and Low Back Radiation and Thin Antenna Designs U..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Hwang, Lih-Tyng ; Wang, Chun-Cheng ; Lin, Hung-Chih.. - p. 103-108 , 2022
Link: https://doi.org/10.1109/..
 
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5

Small Wireless Module Consisting of Two Highly Isolated MIM..:

, In: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
Yang, Chi-Hau ; Ciou, Yi-Ting ; Hwang, Lih-Tyng - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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6

Line Coupling, Ground Defect, Port Termination, and Line Pa..:

, In: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC),
Hwang, Lih-Tyng ; Huang, Ming-Yuan ; Lin, Hung-Chih. - p. 1246-1251 , 2021
Link: https://doi.org/10.1109/..
 
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7

Investigation of Sideway Coupling Effects of Virtual Ground..:

, In: 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
Hwang, Lih-Tyng ; Wang, Chun Cheng ; Huang, Ming Yuan.. - p. 1-3 , 2020
Link: https://doi.org/10.1109/..
 
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8

Beamforming Design using Millimeter wave Dual-Polarized FSS..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Yang, Chi-Hau ; Hsu, Chung-Yi ; Chung, Hung-Wei. - p. 1806-1811 , 2020
Link: https://doi.org/10.1109/..
 
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9

Achieving Beamforming using a Dual-fed Patch Antenna Array ..:

, In: 2019 Electrical Design of Advanced Packaging and Systems (EDAPS),
Yang, Chi-Hau ; Hsu, Chung-Yi ; Chung, Hung-Wei. - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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10

Detecting the Internal Distribution and Structure of Pd-Dop..:

Hwang, Lih-Tyng ; Sung, Yi-Jung ; Feng, Chang-Yi.
Journal of Electronic Materials.  47 (2018)  12 - p. 7258-7271 , 2018
Link: https://doi.org/10.1007/..
 
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11

3D IC and RF SiPs: advanced stacking and planar solutions f..:

Hwang, Lih-Tyng ; Horng, Tzyy-sheng Jason - 1st edition . , 2018
Link: https://onlinelibrary.wi..
 
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12

Thermal analysis of a multi-chip package design:

Darveaux, Robert ; Hwang, Lih-Tyng ; Reisman, Arnold.
Journal of Electronic Materials.  18 (1989)  2 - p. 267-274 , 1989
Link: https://doi.org/10.1007/..
 
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13

A thermal module design for advanced packaging:

Hwang, Lih-Tyng ; Turlik, Iwona ; Reisman, Arnold
Journal of Electronic Materials.  16 (1987)  5 - p. 347-355 , 1987
Link: https://doi.org/10.1007/..
 
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14

A high-performance thermal module for computer packaging:

Nayak, Deepak ; Hwang, Lih-Tyng ; Turlik, Iwona.
Journal of Electronic Materials.  16 (1987)  5 - p. 357-364 , 1987
Link: https://doi.org/10.1007/..
 
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15

Tracked Robot with Blade Arms to Enhance Crawling Capabilit:

Jhu-Wei Ji ; Fa-Shian Chang ; Lih-Tyng Hwang...
doi:10.5281/zenodo.1127259.  , 2016
Link: https://zenodo.org/recor..
 
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