Lim, Dong-Hyuk
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1

A 72-GS/s, 8-Bit DAC-Based Wireline Transmitter in 4-nm Fin..:

Dickson, Timothy O. ; Deniz, Zeynep Toprak ; Cochet, Martin...
IEEE Journal of Solid-State Circuits.  58 (2023)  4 - p. 1074-1086 , 2023
 
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2

An 8-bit 56GS/s 64x Time-Interleaved ADC with Bootstrapped ..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
 
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3

A 72GS/s, 8-bit DAC-based Wireline Transmitter in 4nm FinFE..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Dickson, Timothy ; Deniz, Zeynep ; Cochet, Martin... - p. 28-29 , 2022
 
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5

6.4 A 56Gb/s 7.7mW/Gb/s PAM-4 Wireline Transceiver in 10nm ..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Yoo, Byoung-Joo ; Lim, Dong-Hyuk ; Pang, Hyonguk... - p. 122-124 , 2020
 
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6

Effects of 3D-Printed Polycaprolactone/β-Tricalcium Phospha..:

Shim, Jin-Hyung ; Won, Joo-Yun ; Park, Jung-Hyung...
International Journal of Molecular Sciences.  18 (2017)  5 - p. 899 , 2017
 
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8

Fabrication of optically clear acrylic pressure–sensitive a..:

Kim, Soyon ; Lee, Seung-Woo ; Lim, Dong-Hyuk...
Journal of Adhesion Science and Technology.  27 (2013)  20 - p. 2177-2190 , 2013
 
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9

UV-curing and thermal stability of dual curable urethane ep..:

Lee, Seung-Woo ; Park, Ji-Won ; Park, Cho-Hee...
International Journal of Adhesion and Adhesives.  44 (2013)  - p. 138-143 , 2013
 
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10

Optical properties and adhesion performance of acrylic PSAs..:

Kim, Soyon ; Lee, Seung-Woo ; Lim, Dong-Hyuk...
Journal of Adhesion Science and Technology.  27 (2013)  21 - p. 2265-2277 , 2013
 
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11

MONITORING SEVERE ACCIDENTS USING AI TECHNIQUES:

No, Young-Gyu ; Kim, Ju-Hyun ; Na, Man-Gyun..
Nuclear Engineering and Technology.  44 (2012)  4 - p. 393-404 , 2012
 
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12

Adhesion Performance and Thermal Stability of Fluorinated P..:

Bae, Kyung-Yul ; Lim, Dong-Hyuk ; Park, Ji-Won...
Journal of Adhesion Science and Technology.  26 (2012)  1-3 - p. 361-379 , 2012
 
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13

Composition of Adhesives:

, In: Handbook of Adhesion Technology,
 
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14

UV- and thermal-curing behaviors of dual-curable adhesives ..:

Park, Young-Jun ; Lim, Dong-Hyuk ; Kim, Hyun-Joong..
International Journal of Adhesion and Adhesives.  29 (2009)  7 - p. 710-717 , 2009
 
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15

Curing Behavior and Adhesion Performance of UV-Curable Styr..:

Park, Young-Jun ; Lim, Dong-Hyuk ; Kim, Hyun-Joong..
Journal of Adhesion Science and Technology.  22 (2008)  13 - p. 1401-1423 , 2008
 
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