E-LIB Suche - Ergebnisse für: Lim, Sung Kyu

1

On Legalization of Die Bonding Bumps and Pads for 3D ICs:

Huang, Yen-Hsiang ; Pentapati, Sai ; Agnesina, Anthony..
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. , 2024

Link: https://doi.org/10.1109/..

2

Hier-3D: A Methodology for Physical Hierarchy Exploration o..:

Bethur, Nesara Eranna ; Agnesina, Anthony ; Brunion, Moritz...
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 43 (2024) 7 - p. 1957-1970 , 2024

Link: https://doi.org/10.1109/..

3

GAN-Place: Advancing Open Source Placers to Commercial-qual..:

Lu, Yi-Chen ; Ren, Haoxing ; Hsiao, Hao-Hsiang.
ACM Transactions on Design Automation of Electronic Systems. 29 (2024) 2 - p. 1-17 , 2024

Link: https://doi.org/10.1145/..

4

FastTuner: Transferable Physical Design Parameter Optimizat..:

, In: Proceedings of the 2024 International Symposium on Physical Design,

Hsiao, Hao-Hsiang ; Lu, Yi-Chen ; Vanna-Iampikul, Pruek. - p. 93-101 , 2024

Link: https://dl.acm.org/doi/1..

5

Pin-3D: Effective Physical Design Methodology for Multidie ..:

Pentapati, Sai ; Chang, Kyungwook ; Lim, Sung Kyu
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 43 (2024) 4 - p. 1009-1022 , 2024

Link: https://doi.org/10.1109/..

6

A PPA Study for Heterogeneous 3-D IC Options: Monolithic, H..:

Kim, Jinwoo ; Zhu, Lingjun ; Torun, Hakki Mert..
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 32 (2024) 3 - p. 401-412 , 2024

Link: https://doi.org/10.1109/..

7

DREAM-GAN : Advancing DREAMPlace towards Commercial-Qual..:

, In: Proceedings of the 2023 International Symposium on Physical Design,

Lu, Yi-Chen ; Ren, Haoxing ; Hsiao, Hao-Hsiang. - p. 141-148 , 2023

Link: https://dl.acm.org/doi/1..

8

Built-In Self-Test of High-Density and Realistic ILV Layout..:

Chaudhuri, Arjun ; Banerjee, Sanmitra ; Kim, Jinwoo..
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 31 (2023) 3 - p. 296-309 , 2023

Link: https://doi.org/10.1109/..

9

INVITED: Design Automation Needs for Monolithic 3D ICs: Acc..:

, In: 2023 60th ACM/IEEE Design Automation Conference (DAC),

Zhu, Lingjun ; Lim, Sung Kyu - p. 1-4 , 2023

Link: https://doi.org/10.1109/..

10

GNN-based Multi-bit Flip-flop Clustering and Post-clusterin..:

Vanna-Iampikul, Pruek ; Lu, Yi-Chen ; Shim, Da Eun.
ACM Transactions on Design Automation of Electronic Systems. 28 (2023) 5 - p. 1-26 , 2023

Link: https://doi.org/10.1145/..

11

Transferable Graph Neural Network-Based Delay-Fault Localiz..:

Hung, Shao-Chun ; Banerjee, Sanmitra ; Chaudhuri, Arjun...
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 42 (2023) 11 - p. 4296-4309 , 2023

Link: https://doi.org/10.1109/..

12

Glass Interposer Integration of Logic and Memory Chiplets: ..:

, In: 2023 60th ACM/IEEE Design Automation Conference (DAC),

Vanna-Iampikul, Pruek ; Zhu, Lingjun ; Erdogan, Serhat... - p. 1-6 , 2023

Link: https://doi.org/10.1109/..

13

Snap-3D: A Constrained Placement-Driven Physical Design Met..:

Vanna-Iampikul, Pruek ; Shao, Chengjia ; Lu, Yi-Chen...
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 42 (2023) 7 - p. 2331-2335 , 2023

Link: https://doi.org/10.1109/..

14

A Comparative Study on Front-Side, Buried and Back-Side Pow..:

, In: 2023 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED),

Shaji, Sandra Maria ; Zhu, Lingjun ; Yoon, Junsik. - p. 1-6 , 2023

Link: https://doi.org/10.1109/..

15

RL-CCD: Concurrent Clock and Data Optimization using Attent..:

, In: 2023 60th ACM/IEEE Design Automation Conference (DAC),

Lu, Yi-Chen ; Chan, Wei-Ting ; Guo, Deyuan... - p. 1-6 , 2023

Link: https://doi.org/10.1109/..