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Lim, Sze Pei
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1

Low Temperature Material Discovery and Readiness for 1st Le..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Lim, Sze Pei ; Tsuriya, Masahiro ; Gokhale, Shripad. - p. 61-62 , 2024
Link: https://doi.org/10.23919..
 
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2

An In-containing Lower-Temperature Lead-Free Solder Paste f..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Zhang, HongWen ; Lim, Sze Pei - p. 7-8 , 2023
Link: https://doi.org/10.23919..
 
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3

The Effects of Voids on Solder Joint Reliability in First L..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Lim, Sze Pei ; Lee, Kor Oon ; Oi, Kiyoshi... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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4

Voids in First-Level Interconnects and Their Impact on Sold..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Lee, Kor Oon ; Oi, Kiyoshi ; Lim, Sze Pei... - p. 5-6 , 2022
Link: https://doi.org/10.23919..
 
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5

Low temperature interconnects in 1st level packaging and it..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Arvin, Charles ; Lim, Sze Pei ; Locker, David... - p. 7-8 , 2022
Link: https://doi.org/10.23919..
 
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6

A Drop-In High-Temperature Lead-Free Solder Paste that Outp..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Zhang, Hongwen ; Lim, Sze Pei ; Lytwynec, Samuel.. - p. 69-70 , 2022
Link: https://doi.org/10.23919..
 
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7

A Novel High-Temperature Pb-Free Solder Paste with Enhanced..:

, In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT),
Zhang, Hongwen ; Lim, Sze Pei ; Lytwynec, Samuel... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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8

Low Temperature Material for 1st Level Interconnect in Semi..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Lim, Sze Pei ; Arvin, Charles ; Sweatman, Keith. - p. 378-386 , 2022
Link: https://doi.org/10.1109/..
 
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9

A Novel High-Temperature Pb-Free Solder Paste with Enhanced..:

, In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT),
Zhang, Hongwen ; Lim, Sze Pei ; Lytwynec, Samuel... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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10

Low temperature 1st level interconnect in Packaging and its..:

, In: 2021 International Conference on Electronics Packaging (ICEP),
Lim, Sze Pei ; Arvin, Charles ; Locker, David... - p. 49-50 , 2021
Link: https://doi.org/10.23919..
 
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11

Soldering Material Evolution for Heterogeneous Integration:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Thum, Kenneth ; Lim, Sze Pei - p. 738-742 , 2019
Link: https://doi.org/10.1109/..
 
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12

Warpage Measurements and Characterizations of Fan-Out Wafer..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Lau, John ; Kai, Wu ; Fan, Nelson... - p. 594-600 , 2018
Link: https://doi.org/10.1109/..
 
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13

Reliability of Fan-Out Wafer-Level Packaging with Large Chi..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Lau, John ; Kuah, Eric ; Li, Zhang... - p. 1574-1582 , 2018
Link: https://doi.org/10.1109/..
 
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14

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous ..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Ko, Cheng-Ta ; Chang, Chieh-Lin ; Pan, Jhih-Yuan... - p. 355-363 , 2018
Link: https://doi.org/10.1109/..
 
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15

Fan-Out Wafer-Level Packaging for Heterogeneous Integration:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Lau, John ; Li, Zhang ; Tan, Kim Hwee... - p. 2360-2366 , 2018
Link: https://doi.org/10.1109/..
 
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