Search for persons
X
?
2023 International Electron Devices Meeting (IEDM) ,
6
CMOS-Fabricated Ring Surface Ion Trap with TSV Integration:
, In:
?
2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
7
Reliability Study of Two-Step Plasma-Activated Copper-Coppe..:
, In:
?
2023 International Conference on Electronics Packaging (ICEP) ,
9
Time Evolution Study of Two-Step Plasma-Treated Copper-Copp..:
, In:
?
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
10
Modeling and Predicting the Beam Properties from Grating St..:
, In:
?
2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ,
11
Plasma-Activated Cu-Cu Direct Bonding in Ambient for Die-Di..:
, In:
?
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
12
Comparative Study of Die-Attach Materials for LED Die Bondi..:
, In:
?
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) ,
13
Ceramic Pin Grid Array with Built-in Interconnects to Locat..:
, In:
?
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
14
Two-Step Ar/N2 Plasma-Activated Al Surface for Al-Al Direct..:
, In:
?
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
15