Lin, Ang-Ying
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1

IonBombardment-Induced Stress Mechanism for the Formation o..:

Chuang, Tung-Han ; Lin, Ang-Ying ; Chen, Yen-Ting...
Journal of Electronic Materials.  53 (2024)  5 - p. 2583-2590 , 2024
 
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2

Low Temperature (250°C) and Fine Pitch (≤4 μ m) New Nanocry..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Lin, Ang-Ying ; Lin, Yu-Min ; Lu, Chun-Lin... - p. 1-2 , 2024
 
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3

Ultrasonic Bonding of Ag Ribbon on Si Wafers With Various B..:

Chiang, Meng-Ting ; Lee, Pei-Ing ; Lin, Ang-Ying.
International Journal of Manufacturing, Materials, and Mechanical Engineering.  13 (2023)  1 - p. 1-11 , 2023
 
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5

High density batch bonding technology for chiplet design:

, In: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Lin, Ang-Ying ; Lin, Yu-Min ; Ni, Tzu-Hsuan.. - p. 1-2 , 2022
 
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10

A tert-butyl/cyano substituted (1,2,3,5-dithiadiazolyl)benz..:

Boeré, René T. ; Goh, Lai-Yoong ; Ang, Chwee Ying...
Journal of Organometallic Chemistry.  692 (2007)  13 - p. 2697-2704 , 2007
 
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