Lin, Guan-Sian
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1

Electronic Packaging Interfacial Strength Measurement and D..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Shih, Meng-Kai ; Liu, Yu-Hao ; Lin, Guan-Sian.. - p. 269-270 , 2023
 
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2

Next-Generation High-Density PCB Development by Fan-Out RDL..:

Shih, Meng-Kai ; Huang, Yu-Wei ; Lin, Guan-Sian
IEEE Transactions on Device and Materials Reliability.  22 (2022)  2 - p. 296-305 , 2022
 
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4

Multifunctional conjugated molecules combined with electros..:

Lin, Fang-Sian ; Sakthivel, Mani ; Fan, Miao-Syuan...
Journal of Materials Chemistry C.  10 (2022)  34 - p. 12232-12248 , 2022
 
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6

A Super-Resolution-Assisted Fingerprinting Method Based on ..:

Lin, Yi-Jie ; Tseng, Po-Hsuan ; Chan, Yao-Chia..
IEEE Transactions on Mobile Computing.  18 (2019)  12 - p. 2740-2753 , 2019
 
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13

Analysis of the Aso-Bridge landslide during the 2016 Kumamo..:

Hung, Ching ; Lin, Guan-Wei ; Syu, Huei-Sian..
Bulletin of Engineering Geology and the Environment.  77 (2017)  4 - p. 1439-1449 , 2017
 
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15

Evaluation of an enhanced FS method for finding the initiat..:

Lin, Guan-Wei ; Hung, Ching ; Syu, Huei-Sian
Bulletin of Engineering Geology and the Environment.  78 (2017)  1 - p. 497-506 , 2017
 
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